Electronics Forum | Thu Jun 06 09:28:24 EDT 2002 | Hussman69
Sure do, it's from the paste that gets squeezed under your R's and C's. This paste is now on your mask and during reflow, wants to move off the mask. Unfortunatly, it follows the flux residue to the side of your component. An easy fix is to use th
Electronics Forum | Tue Dec 31 10:06:37 EST 2019 | emeto
This one is easy. Go to 5mil stencil and reduce apertures in width. try to have 10mil aperture width and 10 mil distance in between. If you give us numbers we will be more precise.
Electronics Forum | Mon Jun 21 01:32:20 EDT 2021 | yaxindatech
We can reproduce a prototype for you, if the defect can not be repaired. We are a PCB manufacturer in shenzhen China. It can be manufactured as a sample order in 2-3 working days.
Electronics Forum | Thu Jun 06 15:55:28 EDT 2002 | arzu
I agree with the others and experienced the problem myself this week. Solderballs at the side of the chips. I looked at the board and found that the chip is pressing the paste away too much. This in combination with our quite big pads(and stencilaper
Electronics Forum | Tue Jun 04 17:21:22 EDT 2002 | jasonfang
I found solderballs are around chip components (on one side of middle area), I checked gerber data, solder paste of aperture on the stencil for these chip components have 5% reduction to solder land on PCB, shape of solder land are square, not home p
Electronics Forum | Tue Jun 04 20:34:28 EDT 2002 | russ
Jason, Excessive thermal ramp rates, misprints, improper pad design, paste type, placement pressure, all can cause solderballs. Do the pads on this board meet IPC 782 criterias? I have found that too much pad underneath component can cause this. A
Electronics Forum | Thu Jan 02 10:31:48 EST 2020 | slthomas
It is strange that you're having issues while using the same process parameters (including stencil) that worked successfully before. It doesn't guarantee that it's not one of those parameters changing in a manner that's not apparent, but it does sugg
Electronics Forum | Thu May 26 21:13:17 EDT 2005 | thaqalain
Factors that affect the solder joint quality are *envirinmental condition(i.e.,humidity) *contamination *Flux residues *all of the above
Electronics Forum | Tue Feb 11 12:44:32 EST 2014 | cyber_wolf
Jigo, We have never had a need to do internal testing on solder paste, and your paste supplier should be able to tell you what the correct operating temperature range is. All of the big names in solder paste have tight quality control and I suspect t
Electronics Forum | Thu Feb 13 19:08:31 EST 2014 | darby
Have to agree with Sr Tech and Spoilt - you'd have to really mistreat your paste these days for it to be the root cause. However, try another paste to eliminate that; making sure you abide by the suppliers specs. Pad design, stencil design,(includin
