Electronics Forum | Mon Nov 15 15:27:48 EST 2004 | davef
In creating your solder balls, consider printing or dispensing solder paste on the pads of the LGA and then reflowing the paste.
Electronics Forum | Mon Nov 19 05:49:44 EST 2001 | Cheng
The BGA solder ball composition is 62/36/2 Sn/Pb/Ag, does any problem exist for the solder joint reliability? And what is the difference on SMTA process between this and the normal 63/37 ball?
Electronics Forum | Sat May 04 01:39:28 EDT 2013 | ultimatejoker
Does anyone know what are the available type for LF solder balls? I only know LF35. Is there any other types besides this? Does anyone have the data for the hardness of SAC type and LF type solder ball? Many thanks in advance
Electronics Forum | Mon Nov 15 14:24:17 EST 2004 | nrocco
Im looking for equipment that can attach solder balls between the size 15-25 mils to the leads of a land grid array. There is also the posibility of attaching balls before leads are inserted into the socket. This is a little differant than attaching
Electronics Forum | Tue Mar 19 09:29:08 EST 2002 | Basaran
What type of solder ball defect that you want to avoid is it voids or misregistration or ball-pad adhesion. Cemal Basaran
Electronics Forum | Mon Nov 15 14:26:11 EST 2004 | nrocco
also the balls need to be lead free, just to make it more interesting.
Electronics Forum | Sat Mar 16 11:06:48 EST 2002 | Lau
Hi, I am searching a method of reflow process for less / nothing solder ball defect. Thank Lau
Electronics Forum | Thu Nov 18 09:25:42 EST 2004 | pjc
Vanguard is a ball placement machine. They are out on Long Island NY and manufactured by White Eagle Engineering. The contact person is Pete Heinzl 520-791-0239, pheinzl@whiteeagleeng.com
Electronics Forum | Sat Mar 16 17:53:06 EST 2002 | davef
Not an unusual problem, especially for nc flux users. Search the fine SMTnet Archives for background.
Electronics Forum | Wed Mar 20 11:21:57 EST 2002 | Hussman
It's all in the way you design your stencil.
