Electronics Forum | Mon Nov 19 10:06:15 EST 2001 | davef
Git otta taun!!! I never have heard of an Sn62 BGA solder ball. Several thoughts on Sn62: * Look at http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=4603&#Message17953& * Search the fine SMTnet Archives on � Sn62 �
Electronics Forum | Tue Nov 23 08:49:08 EST 2004 | zanolli
Please contact me offline and I can discuss methods of attaching solder balls to stamped metals contacts �on the fly� while the contacts are still continuously oriented or in reel form. Regards Jim Zanolli Teka Interconnection Systems Phone: 401-785
Electronics Forum | Wed Jun 07 22:02:57 EDT 2006 | davef
Similarly, we have eliminated solder balls by using an aqueous washer.
Electronics Forum | Thu Aug 24 14:42:30 EDT 2006 | any
y we had solder ball after reflow owen?
Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks
IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap
Electronics Forum | Wed Jun 07 10:56:38 EDT 2006 | Chunks
In the past, I would normally tell out highly talented inspectors to leave the balls there. The were trapped in the flux residue and were hard to remove. Never caused a problem. But then there was an incident where someone had the bright idea to u
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Fri May 17 16:37:28 EDT 2002 | Tom Druan
I was wondering if anyone could direct me towards documentation on shear test methods/apparatus to test the bond integrity of a solder ball to its substrate. Thanks.
Electronics Forum | Wed Jun 07 21:45:53 EDT 2006 | davef
We do not understand the question. Take a deep breath, remember not all of us are trained as geologists. The smallest solder ball we've seen is a little less than 5 nm.
Electronics Forum | Fri May 17 16:53:50 EDT 2002 | davef
I recall a couple of papers in the SMTA 'Knowledgebase' that used ball shearing and an element in a study that compared BGA [maybe uBGA] component fabrication methods, er sumpin.
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