Electronics Forum | Thu Jan 24 11:47:15 EST 2002 | Joe B.
Are there any formalized standards for the properties of solder balls? Example properties: sphericity uniformity(variance) of the ball size distribution surface roughness surface oxidation or other surface treatments/contaminants ?? As someone rela
Electronics Forum | Fri May 07 16:28:07 EDT 1999 | Andrew Wulff
On 1.27mm (0.050 inches) Standard Ball Grid Array's. The ball size diameter starts at approximately 0.025 inches. If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? This is a known L
Electronics Forum | Wed Oct 29 23:40:29 EST 2003 | ppcbs
We here at Precision PCB Services, Inc. Perform selective ball removal. We just completed a job today where we removed 4 balls, and then installed traces to dog-bone the pads at two locations on 30 BGA's. An eaisier and more cost effective solutio
Electronics Forum | Thu Aug 12 10:50:19 EDT 1999 | John Thorup
| Hello everyone, | | I would like to know more about the so called FACETED or "Mirror ball" surface apperance. Its cause and how to eliminate / corrective actions for it. | | pls. help... | | thanks and best regargs, | ...Omat | Omat While I hav
Electronics Forum | Mon Oct 15 11:27:48 EDT 2001 | rob_thomas
Hello all, Does anyone have any experience using solder quick preforms for ball attach on Flex? Thanks, Rob
Electronics Forum | Mon Jan 28 20:06:52 EST 2002 | davef
Sounds like an interesting project. In Euroland and Japan, there are political moves with no scientific basis afoot to exclude lead from electronic products. There is a HUGE body of knowledge on the topic. For instance, Electrochemical Publication
Electronics Forum | Fri Nov 07 16:00:45 EST 2003 | Don A
It would depend on how many boards and parts you need to build. I would prefer an etch cut as it leaves the the part intact and you get the strength of the solder joint. It also reduces the handling of the BGA and associated damage from that
Electronics Forum | Mon Dec 05 12:41:40 EST 2005 | stepheniii
thermal cycling chemical reactions (can occur slowly) they were only touching before and not really a solid solder joint
Electronics Forum | Tue Nov 04 16:32:22 EST 2003 | Marc
Marc, I agree with Dennis. Your best method is to apply solder mask over the pads, then install the BGA. You can also remove the balls or completely remove the pads, but it take a skill person to do it. We do all that type precise rework in Southern
Electronics Forum | Tue Jan 29 15:48:31 EST 2002 | davef
On his site "SMT In Focus", our friend Brian Sloth Blitzen lists the following sampling of lead-free [no lead] links: * Alpha Metals: http://www.alphametals.com/lead_free/index.html * Circuits Assembly magazine: http://www.circuitsassembly.com/db_ar
