Electronics Forum | Fri Aug 26 17:27:48 EDT 2005 | saragorcos
Hello there, Most probably, since the solder balls are entrapped, it is a process indicator, but refer to IPC 610-6.5.3.1 on Excess solder / solder balls / splashes - it really depends on what class you are manufacturing, and the minimum electrical c
Electronics Forum | Wed Apr 28 14:58:39 EDT 2004 | davef
Solder ball acceptability: IPC-A-610, 6.5.3.1 & 12.4.10
Electronics Forum | Sun Aug 28 09:23:52 EDT 2005 | davef
Sara Rice: How did you determine the balls were entrapped?
Electronics Forum | Tue Apr 27 12:01:10 EDT 2004 | Dreamsniper
Hi, Can anyone help me as to what is acceptable and reject when it comes to solder balling under BGA's? I've got some BGA's with solder Ball but they seemed to be attached and they are about 10% of the size of the actual soldered BGA joint size. Our
Electronics Forum | Fri Aug 26 10:02:31 EDT 2005 | S vaughan
Hello, Can anyone comment on the implications of small sodler balls under a leadless device such as LLP with a centre thermal land. I believe that we did not make a good reduction and the paste squeezed out of the centre land and balled up under the
Electronics Forum | Mon Aug 29 13:05:11 EDT 2005 | solderguy
Hi All, In IPC-A-610 there is a definition for what constitutes "Entrapped/encapsulated/attached" on page 5-14 in the note. It says that it means that the ball will not be dislodged in the normal service environment of the product. Jim Jenkins
Electronics Forum | Thu Sep 01 09:05:47 EDT 2005 | russ
Thermal pads located underneath leadless devices require a 50% reduction in the stencil aperture.
Electronics Forum | Thu Sep 01 11:25:21 EDT 2005 | chunks
Unless it is peppered with via holes. Then it depends on the size of the pad and via holes.
Electronics Forum | Mon Sep 19 09:31:28 EDT 2016 | emeto
Whatever the cause is, will be fixed by applying less paste. So Homeplate it is.
Electronics Forum | Wed Aug 31 12:49:04 EDT 2005 | kmeline
I have been having the same problem with the LLP. I have three stencil I have done reduction on. The first I went by the manufacturing recommendations. The last two I have done more reducing for the thermal pad. The last one was at a 20% reduction an
