Electronics Forum | Fri Nov 23 16:32:05 EST 2007 | davef
There a several things you can do to prevent the solder wicking down the hole with the current design, and that's where you should focus. Cost goes up as you go down the list, but in neither case do you need to respin the board, have solder starvatio
Electronics Forum | Thu Apr 11 19:06:59 EDT 2002 | tmarc
We are using 1mm pitch BGAs with a great quantity of via(s) under the component. Very shortly we will be placing CSPs with .65mm pitch. Our via(s) are solder masked, however we generally have a percentage of them that the masking is thin enough that
Electronics Forum | Thu Jan 09 20:52:02 EST 2020 | Mike Konrad
If the world was a perfect place, I would recommend preventing solder balls in the first place. While low amounts of solder balls are common, a high volume of solder balls are problematic to a cleaning machine (batch or inline). Solder balls may beco
Electronics Forum | Sat Jun 05 13:38:22 EDT 2021 | ppcbs
For Linear Tech LGA's we solder bump the LGA using a .30mm solder ball then reflow with a tacky flux. This will provide a void free solder joint and adds a little height to the solder joint in case you use a flux that you want to clean from under th
Electronics Forum | Wed Jul 02 07:00:56 EDT 2003 | davef
Title : SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE Author : Fay Hua et al. Author Company : Intel Corporation Date : 01/01/2003 Source : Journal Of Surface Mount Technology, Volume 16-
Electronics Forum | Fri Jun 14 14:25:05 EDT 2002 | davef
Good job clarifying things. So, your MELF are just rolling off the pads. So much for the rocket scientist that talked you into those �V� shaped apertures, eh? [Or taking it the other way: Wow, just think how bad it would be if they weren�t worki
Electronics Forum | Wed May 12 07:53:28 EDT 2004 | solderpro
Lets make it easy on the poor guy, some are correct, check you profile but remember one thing most do not apply, it is important to match the type of paste you are using with the style of oven and configuration. send a direct email and I will give so
Electronics Forum | Wed Aug 19 16:28:03 EDT 2015 | mdeley
Looking for a Santa Clara area contract service with capability to attach 15mil dia. solder coated Cu balls, ideally on a 12" x 18" PI panel, small job to start. T&R services are a plus. My initial search is coming up with device/component level r
Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake
I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th
Electronics Forum | Fri Oct 12 16:01:23 EDT 2018 | davef
Feature||Class 1||Class 2||Class 3 Circular wetting of solder of the lead and plated hole barrel on the component side.||Not Specified||180 deg||270 deg Plated hole fill.||Not Specified||75%||75% Circular fillet and wetting of solder of the lead a
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