Electronics Forum | Thu Jun 24 23:00:36 EDT 2004 | yukim
Tried with several lots of solder paste, manufactured in Feb and March this year. Work ambient: 25C, 60~70%. Is this humidity too much? I'll reduce the ramp in our profile. One change: We changed the conveyor motor in our reflow oven just before the
Electronics Forum | Thu Jul 17 12:59:56 EDT 2008 | gabriella
I would say the balls are aminly on passive parts in the middle.
Electronics Forum | Tue Jun 12 18:08:44 EDT 2001 | davef
I'd say that this is close enough to call a meeting of your Material Review Board and hash this out.
Electronics Forum | Sat Jul 03 02:16:56 EDT 2004 | yukim
What's the difference between static and dynamic viscosities? Is there any relationship between Brookfield and Malcom Viscosity Values?
Electronics Forum | Thu Jul 22 16:06:07 EDT 2004 | russ
What is your pad dimensions/spacing at components you are having trouble with
Electronics Forum | Tue Jul 15 10:47:23 EDT 2008 | Emil
8+2cooling) paste Aim NC254 Thanks in advance!
Electronics Forum | Thu Jul 17 20:41:11 EDT 2008 | davef
"Are you sure your washer is set up correctly?" Now, that's funny!!!! ;P
Electronics Forum | Fri Jul 18 07:18:34 EDT 2008 | realchunks
Try using a homeplate design on your stencils. Works every time.
Electronics Forum | Tue Nov 12 13:03:38 EST 2019 | alexeyzb
Some problem with screen printer process. You need to show photo of defect for understanding.
Electronics Forum | Mon Jun 11 10:41:16 EDT 2001 | techment
Can someone helps to interpret the IPC-A-610's requirement on solder balls ( less than 5 mils in diameters.). We found about 6 to 10 balls ( less than 5 mils ) scattered in a 600 sq mm board. Is it consider failing for class 2 product ?. Thank you.
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