Electronics Forum | Wed Nov 13 12:06:53 EST 2019 | slthomas
The answer is usually either too much paste or paste being deposited where it doesn't belong. In some instances the two are related. You don't say what kind of parts you're having problems with and that matters too. I agree with the previous poste
Electronics Forum | Mon Nov 18 02:44:33 EST 2019 | pate2418
Did you reduce the apertures in the stencil? There can also be very large contact SMD pads. Can be the wrong the thickness of the stencil (thicker than need)
Electronics Forum | Fri Jul 18 16:02:25 EDT 2008 | wrongway
I think Real Chunks has your answer home plat or reverse home plate or like we use a 10% reduction on most aptures vs pad I think your problem is to much paste on the pads we used to see a lot of that with 8mil stencil thicknes on our 1206 caps went
Electronics Forum | Mon Jul 28 13:16:47 EDT 2008 | realchunks
Be careful of just reducing your aps. Too much can cause tombstoning if your print is slightly off or your placement isn't right on. Also be careful of the "pac-man" type of ap - it can lean to asty cuts if you wipe off your stencils by hand. Do
Electronics Forum | Tue Jun 20 15:08:30 EDT 2017 | ranap121212
Hello I have the problem with selective soldering on the robot. Thin balls appear on the laminate. The tin sometimes shoots...? and then the balls are a few millimeters from the soldering point. I tried up or down with temperature, but it did not wor
Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F
Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is
Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F
Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is
Electronics Forum | Tue Feb 27 22:04:45 EST 2001 | hany_khoga
Dear all: I need to know why do I find a lot of solder balles every where on the solder side of my assemblies after coming out of the wave solder machine. How can I avoid this? Thanks Hany
Electronics Forum | Thu Jun 27 21:28:42 EDT 2002 | davef
You're correct that the Ni/Pd termination seems to have something to do with you solder balling. It could be related to the interaction between your paste and the Pd. I assume these are really 'fines' rather than 'balls'. Things that come to mind a
Electronics Forum | Wed Feb 28 10:00:46 EST 2001 | dason_c
Please advise what kind of the solder mask, glossy or matt? Matt finished can reduce the solder ball significant. Check Enthone, Enplate DSR Series. Good Luck!
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