Electronics Forum | Wed Sep 19 10:27:03 EDT 2012 | davef
My email mail machine couldn't send this to you ... Hi Stivais ... I didn't read the report. It seems to require downloading of a 'reader' of some sort. No thanks. If you would, just attach the report to this email. Regardless, energy-dispersive X-r
Electronics Forum | Thu Aug 10 13:16:17 EDT 2000 | Bob Willis
Here is some thing that I wrote a while back on solder beading. First what is a Solder Bead? The term solder bead is used to differentiate it from solder balls. A solder bead is a solder ball but its location is normally constant unlike solder bal
Electronics Forum | Thu Mar 29 13:15:18 EDT 2007 | adrian_nishimoto
We always apply solder paste to either the PCB pads or the BGA balls. I have found that only using liquid or tacky flux does not always ensure proper wetting of the pads. Also The BGA sits closer to the PCB making cleaning and endoscopic inspection
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Tue Jul 18 20:10:09 EDT 2000 | Dave F
Hey Bud: Thanks for the response the other day. We currently use "Jeff�s Method #2: The Drummel Tool." Short answer to your brother is ... yes, probably. Expanding a bit: � It would be surprising not to use a flux to help reflow the solder balls
Electronics Forum | Mon Nov 17 09:47:25 EST 2008 | cisridn
I would not recommend doing BGA soldering with only a hot air gun. I have done it in the past, but the boards would eventually come back from the field because the solder joints did not form correctly and the BGA would have to be reworked again. I
Electronics Forum | Mon Dec 12 09:39:39 EST 2005 | Amol Kane
thank you devef....My point is this....If you solder all the areas that have Imm Sn on them, there wont be any whisker formation DUE TO THE IMM TIN COATING.....whiskers could still potentially form as a result of COMPONENT FINISHES and effective miti
Electronics Forum | Mon Mar 09 16:36:38 EST 1998 | Jim McLenaghan
| We have a double sided pcb that is surface mount on both sides. Now a Through Hole connector has been added. Appart from hand soldering does anyone have info. on reflow soldering the part. The connector is 0.1mm pitch, square legs. | 1) Do you need
Electronics Forum | Fri Mar 26 09:00:19 EDT 2010 | krish_bala
Thank you Graham for the response. The particular BGA that we currently Bake is a Level 3 BGA, which means the BGA will expire in 7 days after removal. We are currently baking the BGAs once a week for the problem described above. These devices are u
Electronics Forum | Mon Apr 12 19:22:54 EDT 2004 | russ
So if I get this right, your customer wants you to run this product as pb free even though it is not. In order to run this as pb free you need to run pb free paste. If you use 63/37 paste at the higher temps I believe that in addition to the compon
