Electronics Forum | Thu Jun 22 09:33:40 EDT 2000 | Sal
Guys Just completed a PI build. And for the first time found that some chip components are skewing. The board is approximately 8x8inches and is six layer double sided FR4. To minimise and eradicate solder balling all the chip components have been co
Electronics Forum | Fri Jun 23 11:49:29 EDT 2000 | Big H
Is it just like that "smart" golf ball - where you tell it, "stop!!! stop!!!" ....or "go further!" go further! So this smart solder, you can tell it "don't skip!! don't skew!!"
Electronics Forum | Thu Jun 22 12:06:10 EDT 2000 | Wolfgang Busko
Hi Sal, I assume your homeplates are designed with the peaks towards the componentcenter. I can imagine that due to placement inaccuracy not both sides sit in the same amount of paste and that wetting difficulties prevent same force factors for both
Electronics Forum | Mon Jul 16 21:25:26 EDT 2001 | davef
Sure, use of U-shape apertures is another way to reduce the amount of paste that you apply. That and similar schemes mentioned in the article are not a function of the flux used. We have used U-shaped apertures for MELF and mini-MELF. They are sug
Electronics Forum | Fri Dec 07 11:46:28 EST 2001 | Brian W
Before changing solder pastes or jumping through too many hoops, check the melting point of the 100 Sn (pure tin) connection. According to Kester, the melting point of 100Sn solder paste is 232 degrees C. If you do not reach that temperature, you wi
Electronics Forum | Mon Dec 10 16:44:51 EST 2001 | davef
Good for you!!! Similar to Steve's comments ... 1. NON-WETTING DEFECT: Yes. Your Lonco is a �stand and deliver� flux. Not some limp wrested impersonation of a flux like most nc fluxes. Without speculating about �incompatability�, recognize that
Electronics Forum | Fri Dec 07 15:23:27 EST 2001 | davef
I'm with Brian. TIN COATED 0603 FAILURES Welcome to the lead-free generation. ;-) The Eurolanders are so blanking stupid, it just makes my head hurt. But then again, it doesn�t take much. OK, enough pontification. Your profile is setup incorrec
Electronics Forum | Fri Dec 07 10:56:24 EST 2001 | franciscoioc
HI, I exeperience this problem before and I tried diferent type of solder pastes.The one that help my process is a Kester solder R596L OA this is a water soluble paste that i am very sure is going to help you.You can get the technical data at http:/
Electronics Forum | Mon Dec 10 04:15:01 EST 2001 | Beny
Thanks for your advise Now I don't found Non-wetting defect at TIN COATED 0603 after I had increased peak temp and Time above 183 C. At film caps, I still found Non-wetting in high rate at film chip size 2416. I using PANASONIC's part with identif
Electronics Forum | Thu Dec 06 23:34:25 EST 2001 | Beny
Pls. help. I�ve problem with non-wetting defect at capacitor termination. I have faced this problem at the 2 kinds of termination. One is chip capacitor 0603 that its outer termination surface composed with 100 Sn (Lead free) and another one is Sta
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