Electronics Forum | Fri Aug 26 17:27:48 EDT 2005 | saragorcos
Hello there, Most probably, since the solder balls are entrapped, it is a process indicator, but refer to IPC 610-6.5.3.1 on Excess solder / solder balls / splashes - it really depends on what class you are manufacturing, and the minimum electrical c
Electronics Forum | Mon Aug 29 11:05:10 EDT 2005 | foresiteeric
davef: I am a colleague of Sara at Foresite and we came to the conclusion that the solder balls were entrapped based on the minimal amount of information from the original question and the fact that the x-ray showed the balls and it wasn't mentioned
Electronics Forum | Sun Aug 28 09:23:52 EDT 2005 | davef
Sara Rice: How did you determine the balls were entrapped?
Electronics Forum | Thu Sep 01 09:05:47 EDT 2005 | russ
Thermal pads located underneath leadless devices require a 50% reduction in the stencil aperture.
Electronics Forum | Thu Sep 01 11:25:21 EDT 2005 | chunks
Unless it is peppered with via holes. Then it depends on the size of the pad and via holes.
Electronics Forum | Wed Aug 31 12:49:04 EDT 2005 | kmeline
I have been having the same problem with the LLP. I have three stencil I have done reduction on. The first I went by the manufacturing recommendations. The last two I have done more reducing for the thermal pad. The last one was at a 20% reduction an
Electronics Forum | Mon Aug 29 13:05:11 EDT 2005 | solderguy
Hi All, In IPC-A-610 there is a definition for what constitutes "Entrapped/encapsulated/attached" on page 5-14 in the note. It says that it means that the ball will not be dislodged in the normal service environment of the product. Jim Jenkins
Electronics Forum | Fri Aug 26 10:02:31 EDT 2005 | S vaughan
Hello, Can anyone comment on the implications of small sodler balls under a leadless device such as LLP with a centre thermal land. I believe that we did not make a good reduction and the paste squeezed out of the centre land and balled up under the
Electronics Forum | Thu Jul 05 10:45:01 EDT 2001 | dougie
Steven, There is a load of info on this if you check through the archives. Quick pointer though are: Solder balls are caused by paste creeping under the component at placement. The part is placed and the paste is squashed under the component, when t
Electronics Forum | Wed Feb 07 16:14:54 EST 2001 | Antonio
I've recently read a posting here which said that the person was trying to reduce solder balls. One of the things the person had done was to adjust the reflow profile so as to be hotter and longer in the reflow state. Am I wrong here? I thought th
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