Electronics Forum | Thu Dec 16 16:46:47 EST 1999 | Mike Naddra
Steve , I use a general set of guidlines when developing reflow profiles: Ramp rate to 140 deg C - 50-60 seconds Time at preheat (140-160 deg C) - 90-120 sec Time above liquidous (183 deg C) - 45-90 sec Time at peak (215-225 deg C) - 9-12 sec peak t
Electronics Forum | Thu Nov 08 10:52:22 EST 2012 | Bryan Ng
I am considering using high-temp ball Sn10Pb90 + eutectic solder paste for MLC reflow (no underfill). You can see that there is no Intermetallic bond for the paste and the balls. Under high stress/shock condition, the solder joints develop micro c
Electronics Forum | Sat Apr 30 00:28:46 EDT 2005 | thaqalain
I failed in a Soldering interview.My recruiter send me for PTH wave soldering. The company given me a small board and asked me to take out rectangular prismatic shape PTH components,I tried to put two guns around solder bonds one by one alongwith flu
Electronics Forum | Mon Jun 18 11:06:31 EDT 2001 | Gil Zweig
In-line systems are effective in detecting the obvious defects such as solder bridges, missing balls and excessive solder voids. They may not be as effective in detecting the subtle changes in solder bond shapes (signatures) indicating loss or chang
Electronics Forum | Mon Jan 07 13:18:28 EST 2002 | mregalia
I work for a microwave company. On our lower frequency boards (
Electronics Forum | Wed Jan 09 21:19:49 EST 2002 | davef
When I said "In this area, there is no difference between your experience in ceramic substrates and PTFE substrates." I was referring to the area we were discussing ... gold plating. I am sorry if you thought I ment than the wire bonding process wa
Electronics Forum | Mon Apr 04 17:32:07 EDT 2005 | toromaster
we also have a need to measure the solder bond strength of our gull wing parts on our pwb. there are many published comparisons between eutectic SnPb and no Pb solders out there. the number that comes to mind is about 10N to 15N. I have not looked
Electronics Forum | Wed Jan 09 14:52:53 EST 2002 | Chris
Hi, I have read many articles about theromsonically bonding to soft gold. Many of these articles state you can bond to 10uinches of gold. I have worked with both Hughes and Panasonic bonders at two different companies and I have never been able to
Electronics Forum | Wed Jan 09 18:17:15 EST 2002 | Chris
I don't have a plasma cleaner either. It will help a lot. Actually I don't clean at all. Our wirebond pads are far enough away so the flux residue does not get on the wirebond pads. That's what we think anyway. I am sure we have some degree of c
Electronics Forum | Wed Jan 09 17:03:44 EST 2002 | rob_thomas
We follow IPC-2221 recommendations for Au and don't have a problem as long as the Ni is under 150 microinches.This ensures a consistent process for us.Also we do plasma clean after SMt and prior to wirebond.That makes a big difference. Rob
