Electronics Forum | Fri Jan 26 11:18:54 EST 2007 | samir
Chunks! Good to see you here. From what I've been taught, and from what I've read, the strength of the solder joint is in the intermetallic bond which occurs at the atomic level. A solder FILLET is an indicator that wetting took place.
Electronics Forum | Mon Mar 03 10:38:28 EST 2003 | davef
Electroplated nickel and electroplated gold is the more �traditional� finish for aluminum wire bonding. That surface was an extension of gold thermosonic wire bonding that requires a thick [50 thou min] gold surface. For years fabricators recommend
Electronics Forum | Mon Dec 20 16:34:15 EST 2004 | steve
Customer has tried OA and NC alloy solder pads may be nickel Chromium. Non-wetting issue. Scraping pad alloys a bit of adhesion of solder but no intermettalic bond. Any suggestions?
Electronics Forum | Mon Nov 14 09:57:37 EST 2005 | davef
If the solder that you apply bonds well to the metal terminations of the transformers, your customers should have no solderability problems related to your components.
Electronics Forum | Fri Feb 11 09:44:01 EST 2005 | pjc
A touched-up solder joint is never as reliable as one soldered correctly by machine. Touching up adds more heat thereby increasing the thickness of the intermetalic bond. Our goal is to have the thinest intermetalic bond in our solder joints. The int
Electronics Forum | Mon Sep 09 18:10:35 EDT 2013 | davef
I don't know, but here is a link to a paper from the fine SMTnet Technical Library on a similar topic: http://www.smtnet.com/library/files/upload/Wire-Bonding-and-Soldering-on-Enepig.pdf Contact the authors and ask for their advice and help. BR, d
Electronics Forum | Mon Jun 18 15:54:25 EDT 2001 | Gil Zweig
For BGA inspection, it is my feeling that he most effective technique a facility can use is the combination of a transmission x-ray system in conjunction with an endoscope (side viewing optical microscope). In using the transmission x-ray inspection
Electronics Forum | Thu Dec 17 03:20:32 EST 2009 | tod1967
Sounds like a good challenge. What is your interconnect bond method? Solder Paste, Pre-Form/Liquid Flux or Paste, Assuming your using solder. Reflow method?
Electronics Forum | Tue Mar 03 09:37:54 EST 2015 | capse
Hot bar soldering or hot bar bonding with ACF is widely used for your applications. A company I represent can assist you; Fancort Industries.
Electronics Forum | Thu Dec 03 11:11:01 EST 1998 | David Pinsky
| Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. | Any in
