Electronics Forum | Thu Dec 03 11:41:05 EST 1998 | Earl Moon
| | Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. | | An
Electronics Forum | Thu Dec 03 12:43:38 EST 1998 | Ryan Jennens
| | Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. | | An
Electronics Forum | Sun Aug 10 03:39:21 EDT 2008 | eyalg
Thanks Pete yes we usu ROHS solder paste in our process. I agree that this termination is more suitable for adhsive bonding rather than soldering. We'll try changing the termination type as you recommended. Eyal G
Electronics Forum | Mon Oct 04 07:47:34 EDT 1999 | park kyung sam
| | What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | | | How about curing bottom side first and reflowing top side later? | | | | What percentage of companies run
Electronics Forum | Tue Aug 25 10:25:56 EDT 2009 | grahamcooper22
Do you know the exact BGA sphere alloy make-up and the alloys melt temp ? Then you can judge the ideal reflow temperature. Also, does the package warp in the reflow zone ? This may be causing the solder spheres on the BGA to lift off the pcb and henc
Electronics Forum | Tue Mar 03 03:31:07 EST 2015 | vb7007
Hi We are trying to Solder LCD Flex to PCB. Few suggested Z-Axis Film (Conductive tape) which can be stuck between Flex-PCB and bonding by applying hot soldering iron across the flex. Is this effective method. If there is any other option, please su
Electronics Forum | Sat Dec 04 09:23:20 EST 1999 | Christopher Lampron
Kantesh, Does this particular part have a heat sink across the bottom side of the component and does your pad size and stencil aperture match the component? I have just had a very similar problem with a DPAK. What we found was that the recomended pad
Electronics Forum | Fri Aug 17 01:40:55 EDT 2001 | V.RAMANAND KINI
We are in the watch & clock Business. We have a Watch IC chip that has to be wirebonded using Ultrasonic aluminium wedge bonder. The wire dia is 1.25mil. The PCB is made of G10 Glass epoxy copper clad laminate. The copper thickness is 18 microns. The
Electronics Forum | Wed Jun 22 09:42:51 EDT 2005 | davef
Not sure what a higher Tg laminate will accomplish. Can't hurt though. Remember, when soldering to Alloy 42, the surface is 42% nickel. So, you need to raise the reflow temperature some 15 to 20*C over what is needed for copper. Also, sometimes All
Electronics Forum | Mon May 29 23:39:11 EDT 2006 | Faizal
Can anyone advice me on the effect of SN100C wave solder on SAC305 hasl board? I suppose the silver content on the hasl pcb would leech(contaminate) into solder pot.? Would it affect the surface bonding between copper pad and the solder.?
