Electronics Forum | Tue Apr 06 17:01:24 EDT 2004 | davef
It doesn't make sense that contamination would form on your gold pads after prebake of 150C for 3 hrs. The contamination must have been there prior to the bake. Your description makes us think of solder mask bleed. Tell us about: * Solder mask * S
Electronics Forum | Wed Feb 10 01:53:04 EST 2010 | sparrow
Hello Glenn, thanks a lot for your response. The company I work for is launching LEDs production this year. We'll need to do a number of the environmental tests in our quality control laboratory. So the application for SAM and Xray systems is inspect
Electronics Forum | Fri Nov 30 14:38:42 EST 2007 | ratsalad
One of our former SMT Technicians used a component we pick and place for this purpose. The component is a bond pad that is soldered to a ceramic PCB during SMT assembly. The assembly is now obsolete. I tried looking up the manufacturer's part nu
Electronics Forum | Wed Feb 14 14:17:41 EST 2001 | Glenn
Does anyone know of any vapor phase oven manufacturers? The application requires bonding a 3-D object at various joint surfaces using eutectic solder. The vapor zone shall require approximately 10 inches of height. The available SMT vapor phase ov
Electronics Forum | Wed Oct 04 14:46:46 EDT 2000 | Kal. Chak.
Hi folks, What are the differences between Epoxy resin(ER)conformal coating and adhesive stacking/bonding material? My PSA/PRA (Post solder/reflow assembly)bracket assembly process got some ER adhesive encroachment on pads/solderjoints. I have chec
Electronics Forum | Fri Oct 31 09:26:08 EDT 2014 | rgduval
I do not recommend ever leaving the top of a via-in-pad open. Cap the via in the pad. Leaving it open for "solder to stuff the hole" causes issues in assembly, notably insufficient solder due to vampirism (the solder wicks into the via, rather than
Electronics Forum | Fri Oct 06 04:23:06 EDT 2006 | David
What is the solder finish of the board?. If this is gold, maybe you should check the reflow profile and max temperature which can easely kill your gold coating so problems with bonding. Also we are using Prozone Multicore with ultrasonic to clean
Electronics Forum | Tue Feb 28 12:41:36 EST 2017 | deanm
Is anybody using Vicor VI Chips (SMT version)? We are using a number of these on some of our boards and are having inaccurate placement and insufficient solder issues (8 mil step stencil still not enough). If you are placing these devices: 1. Which
Electronics Forum | Fri Nov 30 11:49:20 EST 2007 | nkb2400
If the goal is selective soldering (not to raise the substrate temperature too high), consider the use of microwaves. Our company has been working on this technology for selectively bonding substrates. For example, we use the process to bond ROHS met
Electronics Forum | Fri Dec 07 15:17:06 EST 2001 | davef
Dull / shiny, I�m not sure that�s a proper indicator. If �Liquid Tin� adds a thin coat of solderable material without converting the corrosion on the surface of the lead, the corrosion will [probably] continue to increase and potentially affecting t
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