Electronics Forum | Wed Aug 18 16:26:21 EDT 1999 | Tony
Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. This is what I did. Created a removal profile, I had a board
Electronics Forum | Thu Jun 13 19:58:51 EDT 2002 | john_wsme
Dear All, We have a SRT BGA rework machine and we created several profiles following solder reflow reqirement, but when we installed BGAs, we saw a lot of solder bridging in the conner. Please give us some ideas to eleminate this problem. Thanks in
Electronics Forum | Wed Aug 18 21:26:08 EDT 1999 | Dave F
| Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | This is what I did. | | Created a removal profile, I h
Electronics Forum | Wed Mar 11 18:28:03 EDT 2015 | gregoryyork
Hi its undercured solder resist which leaves a clear waxy/oily residue and can be seen as brown tar/oil in the molten solder wave. This also causes MicroSolder Balling and some snail trails of solder pick up and worst case bridging and peeling resist
Electronics Forum | Fri Aug 20 12:41:20 EDT 1999 | stefano bolleri
| | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | This is what I did. | | | | Created a removal pr
Electronics Forum | Fri Jun 14 02:13:11 EDT 2002 | john_wsme
Ross, Thanks for your advice. I will take a look at FAB warp and check the pad size. If you also have any suggestions on rework BGA profile, please share some information which is a great help for us. The best regards, John Need help from everybod
Electronics Forum | Fri Jun 14 14:29:22 EDT 2002 | davef
Russ makes good points. Search the archives for: * Links to rework machine profiles. * Discussion on people causing corner shorts on their BGA, when heating them too rapidly, making the corners to curl like potato [potatoe?] chips.
Electronics Forum | Fri Jun 14 18:01:04 EDT 2002 | john_wsme
Dave and Russ, Today we modified the profile to ramp up slowly and have longer preheat time. The result is great, 0 out of 5 without bridging. I did review the FAB design and seen the pad is much biger than ball size. So I guess it is the problem.
Electronics Forum | Fri Aug 20 14:51:47 EDT 1999 | Tony
| | | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | | | This is what I did. | | | | | | Created a
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