Electronics Forum | Wed Jun 07 10:56:38 EDT 2006 | Chunks
In the past, I would normally tell out highly talented inspectors to leave the balls there. The were trapped in the flux residue and were hard to remove. Never caused a problem. But then there was an incident where someone had the bright idea to u
Electronics Forum | Mon Apr 16 09:12:23 EDT 2007 | davef
Standard for appearance: J-STD-001 and IPC-A-610 committees eliminated the requirement that solder connections be "bright and shiny". Certain solderability protections; such as Au, NiPd, NiPdAu; can affect the surface texture of a solder connection,
Electronics Forum | Tue Dec 23 11:55:37 EST 2003 | Marc Simmel
Details, details: 1) The metal shell is part of the component body. The base metal is austenitic stainless steel (304) that has been plated with 90/10 tin-lead over nickel (semi-bright). 2) The entire part (leads and shell) is elevated by the mass o
Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel
I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa
Electronics Forum | Wed Aug 07 11:36:19 EDT 2013 | rway
By "dark grey color" do you mean with the histogram? Red or black maybe, but grey? Are you using a color camera? Can you use a reverse image? Does a bare unsoldered joint appear bright or reflective under red lighting? You could look for a low wh
Electronics Forum | Tue Sep 24 22:29:04 EDT 2002 | davef
First, I don't have a clear fix on the problem. Please drill-down to more detail. We appreciate that you probably don't know the parlance. Just describe what you have and then what you'd like to have. Second, most 0402 LED are fabricated just lik
Electronics Forum | Mon Jun 21 12:57:10 EDT 1999 | Earl Moon
| | I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something),
Electronics Forum | Mon Jun 21 13:02:59 EDT 1999 | Earl Moon
| | | I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something)
Electronics Forum | Thu Sep 05 21:58:24 EDT 2013 | davef
Both SN100C and SAC305 are excellent and tested LF alloy formulations that with proper process management will produce good looking and reliable solder connections. "Bright & shiny" solder connections is NOT a good measure of a properly soldered LF c
Electronics Forum | Tue Jan 19 10:27:33 EST 2021 | grahamcooper22
Anyone experience high voiding levels in SMT lead free solder joints when the CHIP has bright tin plated end caps ? In the same process, Matte tin plated CHIPs don't show any voiding issues.
