Electronics Forum | Mon Dec 11 06:29:04 EST 2006 | bwet
See before cversus after pics on BGA pad repair here: http://solder.net/services/services_pad-repair.asp The "how to" instructions for traces (and pads) is here: http://solder.net/solderingtips/PadandTrace_Repair_Solder_Tip12.wmv The skill level
Electronics Forum | Tue Jan 22 20:37:48 EST 2002 | davef
Try: * Searching the fine SMTnet Archives. We have ground profiling, thermocouple attach, etc. to pulps. * Buying [ http://www.ipc.org ] IPC-7530 - Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave)
Electronics Forum | Mon Jan 28 07:40:40 EST 2002 | cnotebaert
Yes and Yes, Your solder supplier should recomend a profile (standard profile) in most cases you can follow it. Of course you should be running a thermal profile of each board type to verify it is within the specified temp rang. You should also chec
Electronics Forum | Wed Feb 01 22:27:16 EST 2006 | KEN
Many relays use soldered post coil terminatins inside the relay. In one case many years ago I found the SMT relay manufacturer used eutectic solder inside their hermetic relay. The SMT relay would fail because the solder balled up on the post, woul
Electronics Forum | Tue Jan 31 15:51:04 EST 2006 | russ
Relays huh? I can tell you from previous experience that relays are not a good heat gun candidate. Did you check how long this part can withstand the 240? I do not know what the 4 setting is on a liester but it is probably well in excess of the 24
Electronics Forum | Wed Feb 01 08:12:04 EST 2006 | Chunks
OK, this is easy. You say HIGH fall out, so I can assume 25 or 50%? If so, run 10 without the heat gun and 10 with. This should show you if the heat gun process is the cause or not. If the relay is a surface mount, hand solder them on. If it's a
Electronics Forum | Tue Jan 31 15:40:44 EST 2006 | mgdrouin1
Comp is relay. I've pulled the spec. Max 240. Using Leister h/g with manual temp settings from 1-6 (20 - 600C)set by the operator. Gun was set to setting 4. They are using the heat gun to reflow the solder after SMT but before wave. High fai
Electronics Forum | Mon Jul 01 20:42:54 EDT 2002 | davef
Comments [questions] are: * It�s strange that an uggie ol� SOIC, 50 pitch, BIG honkin� solder pad, kinda thang is failing. Sumpin aint kosher, yano? * Where is the failure occurring [ie, lead to pad, pad to board, etc]? Talk about the breadth and di
Electronics Forum | Wed Sep 07 10:51:04 EDT 2005 | Slaine
an X-ray fluroscope XRF will tell u if there is any lead in it in seconds, without damaging it.
Electronics Forum | Fri Jul 20 17:09:10 EDT 2001 | davef
Circuits Assembly magazine 09/99 "Defluxing with Ultrasonics" by Les Hymes. [There's more but I can't find it right now. I'll add to this as I find the junk, er very nice stuff.] J-STD-001C states that its OK to use ultrasonics for cleaning so lon
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