Electronics Forum | Sun Feb 19 17:01:28 EST 2006 | Baer
A 70 reduction in solder useage is about what we are seeing. You are correct that there are machines that work better with MS2 than others. We are able to make slight modifications to those units, mainly making it more difficult for dross to hide fro
Electronics Forum | Fri Feb 17 14:54:45 EST 2006 | Baer
We have a great deal of new reliability data and we are preparing a full document that shows the statistically valid reduction in solder related defects as well as the improved throughput. It will include all of the SIR test results which are all goo
Electronics Forum | Wed Mar 12 16:30:45 EDT 2008 | operator
I witnessed this at our sister company. It seems to be their standard process. It is not my place to interfere with their processes. I was just curious if there was any chance of brittle solder joints or other defects that might be caused from the WS
Electronics Forum | Wed Jul 02 19:06:21 EDT 2003 | Adrian Espinoza
Last week on my company we began a production for new model. Today we identify a possible non-conformance solder appareance. I have a picture for this defect to show the condition.
Electronics Forum | Fri Apr 04 01:39:21 EDT 2008 | slthomas
All of what Dave says is spot on. I suspect that the most likely corresponding defects on your assemblies would be poor wetting and insufficient solder.
Electronics Forum | Sun Sep 22 09:36:04 EDT 2002 | davef
Sometimes the cut end of QFP leads have corrosion that is very difficult to solder. If this is what you're talking about, it is not a defect according A-610C, 6.5.2, Exposed Basis Metal
Electronics Forum | Wed Mar 15 17:37:30 EST 2006 | Dan Feinberg
Greetings all, Dross has no value to the assembler. It actually degrades quality as a clean solder pot provides a more consistent process. Yes, removing dross does remove some metallic contaminates but that is overkill, like throwing away your refrig
Electronics Forum | Mon Sep 23 03:12:01 EDT 2002 | surachai
We encounter this problem also , I know that it 's acceptable per IPC standard but sometime it fail at ICT and FCT , then this problem should be prevent , we found it with QFP 16 mil pitch and the defect looklike negative wetting at the front of lead
Electronics Forum | Thu Jun 17 17:05:56 EDT 1999 | Chrys Shea
| Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | for example: | | Solder Bridge | 1.verify amount of flux been aplied. | 2.verify turbulance on your solder wave. | 3.etc.
Electronics Forum | Thu Jul 23 16:49:04 EDT 1998 | Ted
I was wondering how successful industry has been in quantifying relationships between defects rates of particular solder problems (like bridging, opens,..) and PCA design parameters (like spacing, part orientation, pad dimensions, ...). For wave sol
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