Electronics Forum | Tue Jan 31 11:56:12 EST 2006 | kmorris
Just wanted to take a quick poll, as to how others are taking flux density measurements on their wave solder machines.(those that don't have flux density contollers) We are using a glass hydrometer, but I see there is a digital model on the market.
Electronics Forum | Wed Feb 01 17:07:15 EST 2006 | Chunks
It does work. I tried it myself back in the day. You might look at used equipment to find and automatic flux density machine.
Electronics Forum | Wed Feb 01 08:27:29 EST 2006 | Chunks
I haven't seen a hydrometer used in years. Are you still foam fluxing? There used to be automatic units available, but with the advent of the spray fluxer, they may have dried up. If you are still foam fluxing with alcohol thinner, place ping pong
Electronics Forum | Wed Feb 01 09:26:39 EST 2006 | pjc
Density is an "implied" measurement to determine activity. Most flux suppliers can sell you a flux acidity (activity) measurement kit. I used one from Multicore a few years back. We used it once in the morning and once after lunch to monitor no-clean
Electronics Forum | Wed Feb 01 10:13:39 EST 2006 | kmorris
I haven't seen a hydrometer used in years. Are > you still foam fluxing? There used to be > automatic units available, but with the advent of > the spray fluxer, they may have dried up. If you > are still foam fluxing with alcohol thinner, >
Electronics Forum | Thu Sep 30 03:37:26 EDT 1999 | Brian
| We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control an
Electronics Forum | Fri Oct 01 00:18:18 EDT 1999 | Earl Moon
| | We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control
Electronics Forum | Fri Oct 01 09:03:25 EDT 1999 | Dave F
| | | We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process contro
Electronics Forum | Fri Feb 20 16:39:51 EST 1998 | Jim Blankenhorn
| I have developed a method to increase SMT circuit density | up to 40%. Looking for interested PCB fabricators and | designers for process improvement. Tell us more. How can it be done and what does it take from a design level. What about solder dra
Electronics Forum | Tue Mar 20 20:14:40 EST 2001 | davef
Electroplating [electrolytic] and dipping [HASL] are the two methods for applying solder coatings to features on boards. Disadvantages of electroplating lead / tin are: * "Weak knees" created at the edge of plated through holes. [I used to get weak k
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