Electronics Forum: solder density (Page 14 of 16)

3355-11 Uh oh!

Electronics Forum | Wed Jun 24 13:46:41 EDT 1998 | Chris Kelly

Brian, a couple of things really stick out here... 1) You are spraying what is referred to here at the CATT as "PINK DEATH" The 3355-11 is about the most active/aggressive flux you can get your hands on. I am concerned about both the condition

Re: uBGA

Electronics Forum | Tue Jul 13 15:04:24 EDT 1999 | Scott McKee

| | | | Hi all , | | | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | | | 2. What type of stencil a

Re: Wave Solder balls

Electronics Forum | Tue Nov 03 16:28:21 EST 1998 | Dave F

| Well my process is I'm running my belt speed at 3.50fpm and about 215 to 225 degrees top side. I got my main wave down to a little less than half the board thickness. I'm not using a hot air knife cause we thought it might create more of a problem

Air Bath Rework System

Electronics Forum | Wed Dec 22 14:21:13 EST 2004 | James Dornan of APE Inc

A little late but if this subject is still of interest the following paper from APE may be of interestwhen considering IR to Air Bath: HOT AIR versus IR and other convection Rework Systems HOT AIR is the most popularly chosen method of rework in th

uBGA Square Pads or Lands

Electronics Forum | Fri Jul 16 14:05:04 EDT 1999 | Jim Blankenhorn

| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t

Looking for a Book/Guide for PCB assembly using SMT

Electronics Forum | Mon Jan 17 07:48:37 EST 2011 | davef

SMTnet Newsletter Aug 1999 by B Ellis Title: A Comprehensive Guide to the Design and Manufacture of Printed Board Assemblies Vol. 1 & 2 Editor: William Macleod Ross Publisher: Electrochemical Publications Limited, GB This two-volume work can p

Re: Residue/Measuring Flux

Electronics Forum | Wed May 27 15:54:09 EDT 1998 | Chrys

| | | | | We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not loca

Re: Batch Cleaners

Electronics Forum | Wed Dec 09 21:45:11 EST 1998 | Dave F

Graham: I agree. Very thorny. What is clean?? And how is that controlled?? Back 25 or so years ago, soldering was done with high solids rosin fluxes. The issue with cleanliness was ionic contamination. The US military and others set a fairly a

Re: Tg - Glass transition temperature

Electronics Forum | Fri Jan 21 14:51:08 EST 2000 | Dave F

Mike: I�d hate to see you making design decisions, based solely on the discussion here, but that this would be an impetus to consult IPC-D-279, "Design Guidelines ... " and take a course on designing reliable boards. Werner Engelmaier (Engelmaier

My Wave Is Getting Fixed...

Electronics Forum | Wed Mar 10 19:40:38 EST 1999 | Steve Gregory

Hey Ya'll, My wave solder is getting fixed (...and the crowd goes wild!). Soltec flew in a gentleman named Jorge (not george, it's hor-hay) and he's taking care of me now. Turns out that the problem had to do with the sprocket bearings down at the e


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