Electronics Forum: solder density (Page 4 of 16)

Solder paste Density

Electronics Forum | Thu Aug 14 13:15:07 EDT 2008 | mbnetto

Thanks Davef! I got have an ideia about the solder paste consumption using this calculator

Solder paste Density

Electronics Forum | Wed Aug 13 12:48:27 EDT 2008 | mbnetto

If I had the stencil and the PCB I would have done this before. But I don't have both!

Solder paste Density

Electronics Forum | Wed Aug 13 12:40:22 EDT 2008 | dphilbrick

easiest way is to weigh an empty board and then weigh a printed board, best to do 10 or so and take an average.

Solder paste Density

Electronics Forum | Wed Aug 13 22:23:24 EDT 2008 | davef

8.4 * SAC305 => 7.36 * Sn-3.5Ag => 7.5 * '....in' [96.2Sn-2.5Ag-0.8Cu-0.5Sb] => 7.39 * Sn-4Ag-0.5Cu => 7.39, 7.44 * Sn-3.8Ag-0.7Cu (Multicore solder) => 7.5

Solder height after reflow

Electronics Forum | Thu Dec 09 07:21:10 EST 2010 | scottp

You won't have 2 mil height because the solder doesn't remain brick shaped. It's a dome. In the past I tried doing some calculations using the formula for the volume of a spherical section and also tried using a simulation program that accounts for

Flux Selection

Electronics Forum | Mon Dec 23 17:20:05 EST 2002 | davef

Try: * Prebake * Flux density * Conveyor speed * Upper preheat * Cooling time * Chip wave * Solder temperature You could add immersion depth (1/3 to 2/3 of the board) to convince yourself that it has the least impact of any variable in wave solderin

soldering robot

Electronics Forum | Wed Mar 28 08:34:31 EDT 2007 | Mark

Hello, I am trying to find out your opinion about using soldering bench top soldering robot to solder THT connectors (diffrent). What is your experinces and what is limitation for this system. We can't use wave soldering machine due to the complex

SPC and Wave

Electronics Forum | Thu Jul 14 11:52:16 EDT 2005 | davef

Sure you can use SPC charting on the wave setup parameters to warn of impending problems. Examples of useful points of analysis are: * Dwell * Temperature * Pot analysis Certainly there's a range of other process controls that could be monitored.

secondary processing of BGAs

Electronics Forum | Mon Apr 02 20:47:22 EDT 2001 | davef

Cuppla questions for ya ... Where are the shorts [above the mask or between the mask and the laminate]? On the board, what material is between the copper traces and the mask? What type of solder mask(s) used by your suppliers? What are they using

Board Profiling

Electronics Forum | Fri Oct 18 21:31:15 EDT 2002 | caldon

Many times the board may look the same but incases there could be subtle differences that could cause your process to go out of process limit. With boards that look alike you still need to consider: Solder paste (Is key to the reflow profile) compone


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