Electronics Forum | Tue Jan 15 15:53:14 EST 2008 | jmelson
I only build my own products, so it has to meet my needs for QA only. I am doing some 20 mil lead pitch (0.5mm) and will soon be doing a 0.4 mm pitch part. I have more magnification on my microscopes (40X) but almost never need to go that high. If
Electronics Forum | Thu Sep 25 12:59:14 EDT 2003 | successmani
hi, I am a research student in Electronics manufacturing at RIT. We are planning to assemble boards using lead free solder paste. I was wondering would there be any changes in printing in using lead-free paste"Sn-3.9Ag-0.5Cu". Thedensity of Sn-37Pb
Electronics Forum | Fri Jun 24 07:32:53 EDT 2016 | davef
Tell us more ... Have you checked the density of your flux? How old is the flux? Is this a spray or a foam fluxer? What type of maintenance is being done? Do you get good hole fill with the the tank pressure of 130 on other boards?
Electronics Forum | Mon Jul 22 18:00:49 EDT 2002 | davef
It doesn't appear to be a proprietary mix. Maybe it's 'neither Alpha Metals nor Kester WILL [want to] supply it.' It's interesting. A lot of the discussion of a solder replacement for 63/37 has centered on high temperature alloys. In real life,
Electronics Forum | Wed Jul 16 14:13:17 EDT 2014 | alexeis
Hi, If you can not rely on your programmer and the tools he uses then "double checking" can save you only materials but in time you really do not save often extend meaning. There are things you can identify before the stove, but if you use tools li
Electronics Forum | Mon Mar 21 12:02:09 EST 2005 | Rob
Hi Colin, Are you using the 1206 package with 4 elements or one of the higher density smaller packages? With the first type you can get them in both Convex or Concave terminations, with most of the solderability problems associated with using the C
Electronics Forum | Wed Jul 22 11:27:25 EDT 1998 | Russ Miculich
I agree with the response and strongly recommend that you use the "home plate" design to reduce solder ball entrapment, and that the under cut for the 0402's in particular be 80% of the pad size. Solder slump is typically about 1.2 to 1 so spread wi
Electronics Forum | Tue Jul 08 06:00:29 EDT 2003 | iman
As part of our process/quality improvement review, it was raised thru' our findings that its a good mfg practice to monitor the incoming solder paste quality (as part of the indirect materials). We get one-page "outgoing QC" vendor reports with each
Electronics Forum | Thu Aug 28 12:18:03 EDT 2008 | grics
Why yes, I regognize all the best. WML, I have an idea... I am going to call it, the Dunker. Instead of anyone foaming, I will get the wave operators to throw the boards into a rubbermaid tub full of flux/gasoline mixture and send through to the wav
Electronics Forum | Tue Jan 12 10:18:36 EST 1999 | Russ Steiner
| Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall quality. But I'm trying for a general answer. On pre-tested assemblies, should you exp
