Electronics Forum | Tue Jan 18 08:40:42 EST 2000 | Dave F
Hey John: Chrys wrote a good description on calculating flux density a while back. Here is our version of her procedure: 4.3 Determine the amount of flux on the board. 4.3.1 Get a piece of corrugated cardboard and a weighing scale accurate to 0.01
Electronics Forum | Thu Jul 17 17:36:28 EDT 2014 | proy
Hi, > > If you can not rely on your programmer and > the tools he uses then "double checking" can save > you only materials but in time you really do not > save often extend meaning. There are things you > can identify before the stove, but if
Electronics Forum | Mon Jun 13 10:28:29 EDT 2005 | andymackie
I've had a lot of experience with solder spatter. It's usually related to moisture (humidity) uptake by the paste, or outgassing from plating: particularly Au/Ni. Solder spatter from the plating will change from board-vendor to board-vendor. I shoul
Electronics Forum | Mon Aug 09 20:47:21 EDT 2004 | KEN
I think OA flux left on the pot would quickly looses its activity and become part of the dross waste stream, and smoke stream for that matter. Also, if your wave is setup properly your selective pallets will scour (push) the top of the lambda wav
Electronics Forum | Wed Feb 28 09:53:17 EST 2001 | fkurisu
Hello Dave, Solder mask rework has been performed on both bare and populated boards. There are factors that come into play with a populated board that make this type of rework more difficult, such as the density of components(especially around th
Electronics Forum | Fri Mar 02 06:25:04 EST 2001 | PeteC
Thanks for your feedback. All the 0603 chips have the round solder lands but the 0805 chips and larger are rectangular. After speaking with the designer on it he said they chose round lands for the 0603 chips to get higher density of the circuit trac
Electronics Forum | Mon Sep 18 12:04:43 EDT 2000 | Erick Russell
Photonic Soldering is useful for several applications in rework where current methods using hot air are inadequate or inefficient. For high-density assemblies, component clearances are limited. In the past, DFM (Design for Manufacturing) specificati
Electronics Forum | Fri Mar 26 17:12:17 EST 2004 | ben
I have recently encountered a new pcb design with a very high density of components on either side of the pcb. One of the suggested "fixes" is to use the smt pads as vias i.e. the via will be drilled thorough the centre of the smt pad. My concern i
Electronics Forum | Wed Jul 28 17:46:13 EDT 2004 | Steve Stach
Both temperature and humidity can cause solder paste to behave in a way to cause these formations. Temperature can cause slumping, slumping spreads out the paste, upon reflow perimeter paste does not join the bulk, and because of insuffient oxide
Electronics Forum | Tue Oct 10 13:30:20 EDT 2017 | charliedci
Here is a link to a reflow profile: http://www.aimsolder.com/sites/default/files/reflow_profile_supplement_-_lead-free_solder_paste.pdf Speaking specifically about solder reflow, the process window should be based on the solder paste you are using.
