Electronics Forum | Mon May 27 11:57:37 EDT 2002 | arcandspark
One thing you should do is characterize your reflow oven, run profile boards of various densities, say 2 gm/sq.in. to 10 gm/sq.in. Adjust the oven settings for these various boards to acheive your standard profile based on your solder paste manufactu
Electronics Forum | Mon Dec 27 13:26:47 EST 2004 | HOSS
Need some feedback here. We're running a foam fluxer using WS chemistry (AIM 715M). We have been running almost exclusively .062 and a few .093" PCBs but we've recently started running some boards that are .100 and .125 thickness and are having tro
Electronics Forum | Wed Mar 02 06:19:03 EST 2005 | pjc
Go to http://www.ipc.org and look up IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components
Electronics Forum | Thu Mar 10 09:13:15 EST 2005 | davef
From http://www.IPC.org ... IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, includ
Electronics Forum | Thu Nov 10 15:43:10 EST 2005 | 1st Article
myu, Is using a 0.6mm stencil wise? 42.5 X 42.5 has two models, the 1mm pitch has 41x41 array with 1657 I/O and the 1.27mm pitch has 33x33 with 1088 I/O. For a typical c-cga with 1.0mm - 1.27mm pitch, may requires a 2mil stencil, 1.0mm pitch gets .
Electronics Forum | Fri Dec 08 19:08:52 EST 2000 | Mike Konrad
I do not know which specific flux you are using, but here are some general guidelines. If your wave soldering machine uses a foam fluxer, then there are foaming agents in the flux. Under �normal� conditions, the volatiles (including the foaming age
Electronics Forum | Thu Oct 22 01:43:43 EDT 1998 | Frank J. de Klein
| My company is looking for higher density for card layout. One suggestion has been locating active components packaged in SOT's and SOIC's on the B-side of the card. This in turn will require wave soldering of the above mentioned components. When I
Electronics Forum | Fri Oct 23 04:16:16 EDT 1998 | Tony B
| | My company is looking for higher density for card layout. One suggestion has been locating active components packaged in SOT's and SOIC's on the B-side of the card. This in turn will require wave soldering of the above mentioned components. When
Electronics Forum | Mon Apr 03 23:17:51 EDT 2000 | Brian G
We have been experiencing intermittent problems with the solder masking bubbling up from the bottom side of the board, after wave soldering. Our board fabricator claims that none of his other customers are experiencing this problem, and that it is pr
Electronics Forum | Thu Feb 19 12:45:05 EST 1998 | Earl Moon
| I have an Electrovert Ultrapak 445 Wavesolder machine with 3 IR preheat zones and a single wave with omega wave. | I want to run a DOE (Taguchi) to determine the optimum settings for soldering both single-sided and | double-sided boards. Can any
