Electronics Forum: solder deposition (Page 1 of 64)

solder paste deposition

Electronics Forum | Sat Jan 07 06:43:44 EST 2006 | davef

Metal is about 50 percent by volume

solder paste deposition

Electronics Forum | Fri Jan 06 19:57:19 EST 2006 | abhinavajmera

What would be the most suitable expression for ratio of Volume of Alloy to Volume of Paste for a solder paste? For example if we use 63Sn/37Pb alloy with a 90 Wt% metal what would be an appopriate expression for the Volume Ratio?

The specification of Paste deposition thickness and volume

Electronics Forum | Fri Sep 21 01:31:13 EDT 2001 | Stoney Tsai

Guys, If there are any specifications or ciriterions for solder paste deposition thickness and volume evaluation. For example, QFP (0.5 mm pitch), 6~8 mils, 3000 mil^3 PLCC: 8~10 mils, ... . . Thanks in advance. Best Regards,

solder balls

Electronics Forum | Thu May 06 10:28:27 EDT 2004 | Bryan She

Modify your stencil aperture shape...reduce the solder paste deposited on pad,will reduce the solder balls.Be sure your reflow profile are good before doing this.rising slope is very important. This is my opinion.thanks. Bryan

Small solder deposits Inspection

Electronics Forum | Wed Apr 30 17:17:21 EDT 2003 | swagner

Since you mentioned voids I take it you are talking post reflow correct?

Small solder deposits Inspection

Electronics Forum | Wed Apr 30 18:38:22 EDT 2003 | Guillermo

Yes, I am sorry I forgot to mention that It's inspection after reflow.

Small solder deposits Inspection

Electronics Forum | Wed Apr 30 12:30:14 EDT 2003 | Guillermo

Hello, I would like to ask for cooments/advices about the inspection of small solder deposits inspection (aprox 4 mills). We tried with X ray and Scanning acoustic microscope but it looks like due to the small size, we could not be sure to get all t

solder paste

Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef

Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c

Hybrid solder balls

Electronics Forum | Fri May 12 07:32:13 EDT 2000 | David Hatherall

Help. We are about to start a project to test the suitability of attaching a ceramic thick film hybrid to a pcb using solder balls. we have no previous experience of this technique and would like a few pointers in the right direction.. eg recommend

solder paste measurement machine

Electronics Forum | Thu Apr 26 11:40:10 EDT 2007 | CL

Good Morning, We have a 3D solder paste inspection machine. We purchased it on a recommendation from a consultant. We are a CM high mix low volume. The President of my company has attended some seminars and meetings where it was conveyed to her that

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