Electronics Forum | Thu Apr 17 16:41:37 EDT 2003 | davef
60% ||||36% of ball area|| >36% ||Class2|| Accept|| Reject ||||45% of ball diameter|| >45% ||||20.25% of ball area|| >20.25% ||Class3|| Accept|| Reject ||||30% of ball diameter|| >30% ||||09% of ball area|| >09%
Electronics Forum | Wed Dec 23 03:33:14 EST 1998 | Charles Stringer
Can anyone recommend a solder stop that can be applied by our PCB supplier. Our current material form Tamura Kaken is causing problems. The material should be capable of withstanding 1 Surface mount IR reflow cycle and 1 wave solder cycle. We need t
Electronics Forum | Tue Dec 29 17:42:27 EST 1998 | Dave F
| Can anyone recommend a solder stop that can be applied by our PCB supplier. Our current material form Tamura Kaken is causing problems. | | The material should be capable of withstanding 1 Surface mount IR reflow cycle and 1 wave solder cycle. | W
Electronics Forum | Wed Feb 12 13:37:22 EST 2003 | dwanzek
I need some input on what good solder thieves dimensions should be. I am limited to solving my bridging problem with solder thieves; all process/wave variables have been adjusted to try to solve this problem. There are several of these connectors on
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
Electronics Forum | Fri Mar 29 10:11:02 EDT 2019 | cyber_wolf
“For a number of years now, work has been proceeding in order to bring perfection to the crudely conceived idea of a transmission that would not only supply inverse reactive current for use in unilateral phase detractors, but would also be capable of
Electronics Forum | Thu Aug 10 13:16:17 EDT 2000 | Bob Willis
Here is some thing that I wrote a while back on solder beading. First what is a Solder Bead? The term solder bead is used to differentiate it from solder balls. A solder bead is a solder ball but its location is normally constant unlike solder bal
Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks
IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap
Electronics Forum | Tue Jan 31 19:34:11 EST 2017 | jgo
I have solder bumps diameters @ 80um, the board pad size @ 100um. Can this size be printed? How about dispensing?
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