Electronics Forum | Fri May 07 15:37:22 EDT 1999 | JohnW
| This is not strictly a surface mount query but any input welcome | I am thinking of using surface mount solder thief pads for a through hole connector. The connector is two rows of 0.1" pitch pins and on waving there is often a bridge on the last t
Electronics Forum | Wed Jul 20 02:48:43 EDT 2005 | grantp
Hi, What's really interesting about your photos is there is solder paste on top of the component. If it was blowing the solder off the board you would see solder paste splatter away from the component. But the solder paste is on top of the compon
Electronics Forum | Wed Oct 04 16:18:06 EDT 2006 | cw
My Peak ~ 228-230C (customer wants to see this temperature). solder ball size - 20mil diameter Please advise ASAP. Thanks a lot!!!
Electronics Forum | Wed Feb 12 12:06:58 EST 2003 | dwanzek
I need some input on what good solder thieves dimensions should be. I am limited to solving my bridging problem with solder thieves; all process/wave variables have been adjusted to try to solve this problem. There are several of these connectors on
Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef
Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly
Electronics Forum | Tue May 23 03:40:20 EDT 2017 | bukas
the problem I had with pump was that turbine intake was eached by alloy. when I repaired intake, it was a irregular hole about 32mm in diameter, mechanics welded piece of plate with a 24mm hole (that was a factory size) we had to reduce pump speed fr
Electronics Forum | Fri Jan 30 00:41:04 EST 2015 | neeraj_iiser
Thanks a lot , my application is cryogenic in nature. I am trying to make a Sub-Angstrom resolution Thermal expansion sensor, whose components have been machined out of OHFC copper, and i needed to solder a manganin wire to one of the capcitor plates
Electronics Forum | Wed Aug 22 09:17:15 EDT 2001 | steven
if do not have x-ray inspection machine, how to verify the 1st board out from the smt placer that the BGA is placed accurately onto the solder pads. the diameter of the solder ball is 1mm. could it self align during reflow?
Electronics Forum | Mon Aug 31 22:30:09 EDT 1998 | Kelly Morris
We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. Our pad design is .020" diameter pads with .025" solder resist diameter. The center
Electronics Forum | Tue Sep 01 19:16:51 EDT 1998 | Kallol Chakraborty
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
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