Electronics Forum | Tue Sep 01 02:50:40 EDT 1998 | karlin
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Fri Nov 09 10:25:43 EST 2001 | steven
is it all right to reflow a BGA using a rework station but without applying a layer of solder paste on pcb. the diameter of the solder ball is 0.75 and the pitch is 1.5mm.
Electronics Forum | Mon May 29 07:46:30 EDT 2006 | bwet
In reviewing the JEDEC 95 guidelines (2002) there is not a mention of tolerances that have been agreed upon for today's finer pitch devices. There was no mention of the solder diameter tolerances (low melt temp) allowed for 0.8mm, 0.6mm and 0.5mm pit
Electronics Forum | Mon Sep 08 02:39:37 EDT 2008 | akareti
By connector, you mean socket? Connector use for board to board connection from FCI, MFG P/N: 84500-202 What is the material of the connector(socket)? Is it very frigale? Housing: liquid crystal polymer Solder ball: SnPb 63/37 how big are the bal
Electronics Forum | Fri Dec 09 08:24:48 EST 2005 | zanolli
Dear Technetters We have a unique soldering operation that needs automation and we will be evaluating various methods including laser reflow and Spirig�s Microflame. The actual soldering operation entails joing two metal contacts by depositing a sol
Electronics Forum | Tue Sep 01 09:02:24 EDT 1998 | Justin Medernach
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Tue May 08 22:34:53 EDT 2007 | davef
Do you mean "how to solve or reduce this defect at wave soldering process" while continuing to use-up my SACX solder? If so, try: * Smaller solder volumes lower shrinkage hole / hot tears [Higher hole diameter versus pin diameter helps in reducing v
Electronics Forum | Wed Aug 05 11:08:36 EDT 2009 | spitkis2
Hi, This may be a bit off the subject but thought I'd ask just in case. I am looking to identify a process / equipment for attaching solder balls to flip chips. Solder balls are 75 microns in diameter. With BGA's there are reballing kits that use
Electronics Forum | Tue Sep 01 19:31:36 EDT 1998 | Kallol Chakraborty
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Tue Sep 01 20:36:05 EDT 1998 | Rin Or
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
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