Electronics Forum | Thu Jun 02 22:26:46 EDT 2016 | slouis2014
i have tried to design the stencil as attached, but the void is more than 35%. do you have any idea what is the ideal diameter for the stencil aperture for the solder to spread and the flux to be released out of the component simultaneously. thanks a
Electronics Forum | Tue Jul 13 18:18:39 EDT 1999 | King Kong
Hi All, Does any one experienced the solder on gold finger after reflow. Its about 5 to 8 mils diameter . We'd clean the entire screen printer, mounter & reflow as well, but doesn't help much.
Electronics Forum | Thu Jun 09 13:38:16 EDT 2011 | rdubya
You might want to check the components as well, I've seen a similar problem with re-balled parts using the wrong diameter ball. that would also contribute to added solder. good luck
Electronics Forum | Thu Sep 29 20:26:58 EDT 2005 | DasonC
Any aperture/stencil thickness suggestion to provide a rigid solder joint for 0.8mm pitch PBGA with 0.4mm ball diameter. The pad is based on IPC7095 and it is 0.3mm. Thank!
Electronics Forum | Fri Jun 28 14:18:46 EDT 2013 | proceng1
I don't see any requirement for a ferrule on the wire. As long as your insulation clearance is twice the insulation diameter or less and the insulation doesn't interfere with the solder joint, it should pass Class 3.
Electronics Forum | Wed Nov 02 01:24:07 EST 2005 | arnold
we are encountering a problem on our production. after dipping a copper wire AWG#30 to a leadfree solder the wire becom thinner and easily to break. does the leadfree soler has the capability to weaken the wire (lessen the diameter)after dipping to l
Electronics Forum | Sun Aug 23 20:24:59 EDT 1998 | Karlin
Hi, Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. We have rule out the possibility of not printing any solder paste there
Electronics Forum | Tue Oct 31 19:34:30 EDT 2023 | dilogic
I have considered this solution, but syringe application is very slow and it's hard to control thickness. It's good for partial covering or applying peelable solder mask. We need to coat circular board ca. 10cm in diameter. Takes a while even with sp
Electronics Forum | Mon Jun 11 10:41:16 EDT 2001 | techment
Can someone helps to interpret the IPC-A-610's requirement on solder balls ( less than 5 mils in diameters.). We found about 6 to 10 balls ( less than 5 mils ) scattered in a 600 sq mm board. Is it consider failing for class 2 product ?. Thank you.
Electronics Forum | Fri Oct 22 23:45:37 EDT 1999 | Jim Cristiano
Hi, I'm looking for vendors that manufacture connector pins that would solder onto the edge of a small SMD pcb so that I can mount it as a SIP onto a larger PCB. Better yet, are there small diameter pins that can be soldered into thru-holes so the SM
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