Electronics Forum: solder diameter (Page 8 of 34)

Re: Aperture size for Micro BGA stencil

Electronics Forum | Thu Jun 22 11:21:59 EDT 2000 | Chrys Shea

My personal opinion: Use 20 mil squares with the corners radiused at 5 mils. The squares offer 2 benefits: 1) A little more paste, which makes for a higher diameter solder column that is more reliable 2) Better stencil release of the paste. It's e

Re: Solder Paste Dispense problems

Electronics Forum | Thu Nov 30 21:13:55 EST 2000 | Dave F

Can't find "WS601" on the Alpha site. What is that stuff? So, with nothing to go on, I'll just guess ... Yer probably cold welding the solder particles together. The nozzle size (inside diameter) determines the dot size. * With glue, small dot si

121-BGA

Electronics Forum | Fri Jan 16 07:06:47 EST 2004 | Mika

Component manufacturer often have recommendation for pad layout and process setup. This should be used as a guideline to help You to set up the process. Exactly what type of component is this, uBGA? We populate 64 I/O uBGA's on our pcb's with 0.3 mm

Soldering wires to through holes

Electronics Forum | Fri Dec 09 11:00:47 EST 2011 | davef

Using common wire size and through hole diameter, we'd expect that the wave solder process would completely fill the through hole and that you wouldn't need to get involved in providing stencil openings, pasting the through hole or reflowing the jump

PIHR... what do you think...?

Electronics Forum | Tue Jun 10 11:44:25 EDT 2014 | patel_daxa29

It is very hard to say by looking at picture(solder joint quality).Overall appearance looks good.If you think is not sufficient solder or meeting required standard, enlarge opening of connector on solder stencil. Make all conn. aperture square or in

Solder Paste

Electronics Forum | Mon Sep 17 17:09:32 EDT 2001 | jschake

Flux: No-clean pastes tend to have a wider print process window in terms of print speed and pressure. More importantly, no-clean pastes are more tolerant to changes in temperature and humidity. They also exhibit longer stencil life than water-solub

Solder Ball Attach (BGA)

Electronics Forum | Mon Sep 24 12:58:31 EDT 2018 | vincentl

We are attaching 0.50mm diameter SAC 305 solder balls onto 0.38 diameter Au plated pins placed at a 0.80mm pitch (pins are pressed into a plastic insulator). A tacky flux is then stenciled onto the pins using a stencil with.a 0.38mm diameter aperture

Need advise on regarding Vias

Electronics Forum | Mon Dec 13 00:48:33 EST 1999 | armin

Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? What�s the term unsupported and supported holes refer to in IPC-2221 9.1.2 Annular Ring Requirements? I have a proto-type PCB (designed by our R&

Fiducials

Electronics Forum | Thu Feb 18 12:56:18 EST 1999 | Bob Barr

We are using .040" diameter fiducials (global and local) on our boards. They are solder covered and HASL. I get batches of boards where the p&p vision system has trouble reading the fiducial. The fiducial looks dark on the screen. The board vendo

Barrel fill with Pb Free Wave Solder

Electronics Forum | Wed Dec 10 16:15:24 EST 2008 | terryl

on the front end in design, minimize the pth connections to ground planes. this takes alot of work by the pcb designer and the approval of the design engineer. connect maximum of 4 ground planes to pth, minimum 1 plane. use spoked connections. ev


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