Electronics Forum | Fri Jun 24 04:51:38 EDT 2016 | unix60959
Hello, Does anyone know where I can find any information or documentation on the miniwave height sensor and control. I feel like the company I'm working for is possibly using the machine incorrectly in this regard. I assume, but would like to verify
Electronics Forum | Thu Nov 08 12:05:05 EST 2007 | jdumont
Hole size may not have been an issue for you because your holes were already big enough? The alloy you are using has a lot to do with this I believe also. We are already at 5 seconds dwell for this which is mfg recommended for our solder. The caps we
Electronics Forum | Fri May 02 09:37:23 EDT 2003 | Jerry Magera
Via in pad is the most efficient use of space. Blind via seems to be blamed for this. Cross-sections (send me some) will probably show a void still existing in the via or spherical voids aligned near the component pad side. One can estimate the vo
Electronics Forum | Tue Dec 29 11:40:24 EST 1998 | Michael Allen
I don't have answers...just comments. We're just starting to assemble CSPs on protos, and I've got the same concerns you have. The MicroBGA package I'm working with has a ball diameter of 0.325mm (0.0128") and a standoff of just 0.010" BEFORE solde
Electronics Forum | Tue Sep 01 10:39:30 EDT 1998 | Mike
| | | We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | | | Our pad design is .020" diameter pads with .025" solder resist diameter.
Electronics Forum | Thu Feb 05 08:39:16 EST 2004 | davef
IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards, Table 9-3 � Plated Through Hole Diameter To Lead Diameter Relationships will give you the standard information you require.
Electronics Forum | Tue Aug 03 14:46:25 EDT 2004 | russ
We recommend to the designers "the smallest diameter that you can get away with", that will help reduce the solder scavenging into via diring reflow. unless you are planning on having them filled as Dave F mentioned. Russ
Electronics Forum | Mon Aug 24 08:34:14 EDT 1998 | JUSTIN MEDERNACH
| Hi, | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | We have rule out the possibility of not printing any solder paste
Electronics Forum | Wed Sep 02 08:52:13 EDT 1998 | Justin Medernach
| | We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | | Our pad design is .020" diameter pads with .025" solder resist diameter. Th
Electronics Forum | Thu May 31 10:21:16 EDT 2001 | davef
On "Flip Chip/uBGA Under-fill Visual Standards" � The third "Satisfactory" [The under-fill if by design should be visible � ], here the notation "if by design" is unclear. Does "according to product documentation" get to the point? The first "Acc
.gif)
