Electronics Forum | Mon Jun 11 22:00:19 EDT 2001 | davef
IPC-A-610 uses words to the effect that it�s a Class 2 process indicator, if either: * Entrapped or encapsulated solder balls that are within 0.13 mm [0.00512 in] of lands or connectors, OR * Entrapped or encapsulated solder balls exceed 0.13mm [0.00
Electronics Forum | Wed Sep 08 16:44:15 EDT 1999 | Rob Jankowski
I am wave soldering a single sided through hole PCB array with (6) .040" round diameter pins that sit .5" off the PCB, and .080" apart. The problem being experienced is that solderballs are appearing on the end of the pins. I have tried decreasing
Electronics Forum | Mon Aug 20 10:57:29 EDT 2001 | Hussman
This connector requires a hole size of 0.055" diameter. A little too large for pin and paste.
Electronics Forum | Tue Mar 31 22:00:27 EDT 2009 | padawanlinuxero
lol!, they are in the middle of some 0805 and the diameter dunno but they are small.
Electronics Forum | Fri Dec 07 02:53:26 EST 2012 | beta
no expert but would using a smaller diameter nozzle help in anyway?
Electronics Forum | Tue Dec 19 20:01:41 EST 2000 | Lisa Murphy
Hi, I have recently been asked if I had any information on the voltage capacity of a solder ball. I asked around and did a web search but came up empty handed. Usually people are concerned with the current carrying capacity of bondwires, flip-chip
Electronics Forum | Tue Mar 14 07:59:41 EST 2000 | JAX
Emmanuel, The discussion on what finish to use whether it be HASL, Immersion gold over nickel, Organic Solderability Preservatives, ect...... is still ongoing. This is not the only decision you need to make. Do you plan on Soldermask Defined Pads? Wh
Electronics Forum | Tue Mar 14 07:59:41 EST 2000 | JAX
Emmanuel, The discussion on what finish to use whether it be HASL, Immersion gold over nickel, Organic Solderability Preservatives, ect...... is still ongoing. This is not the only decision you need to make. Do you plan on Soldermask Defined Pads? Wh
Electronics Forum | Thu Jun 03 17:43:34 EDT 2004 | g2garyg2
Hi Doug, Read your inquiry. My company PRO-MATION has some exciting technologies available for both top side and bottom side selective laser soldering. Our work cells are great for low volume / high mix environments and are capble for both Tin Lead
Electronics Forum | Wed Jan 04 15:10:27 EST 2006 | grantp
Hi, That's the main problem. I quickly checked out the motorola document, and thanks for posting that, but the main reason for failure seems to be that the ball is not touching the solder pad. I wonder what kind of ball size tolerance they had on th
