Electronics Forum: solder flakes in mask (Page 1 of 8)

Ammonia in Peelable solder mask compatability to lead free

Electronics Forum | Wed Jun 22 14:14:42 EDT 2005 | Steve

Tin/Lead we have had no problem in masking off areas on a pcb during wave soldering. Lead Free alloys, Nickel Silver Copper would there be any compatability issues with a Peelable latex solder mask containing Ammonia. Really hot need to know.

Ammonia in Peelable solder mask compatability to lead free

Electronics Forum | Wed Jun 22 15:03:12 EDT 2005 | patrickbruneel

The only thing ammonia can do is tarnish copper and make it more difficult to solder. And the higher temp in lead-free will discolor the latex (giving it a sticky surface), but the functionality of the mask will be intact. There should be greater co

Ammonia in Peelable solder mask compatability to lead free

Electronics Forum | Wed Jun 22 16:11:13 EDT 2005 | Steve

You know Pat, I should just call you directly rather than post this stuff. You always have an answer. You must have been around awhile huh? :)

Solder mask and fine pitch devices

Electronics Forum | Tue Jan 15 10:53:18 EST 2013 | boriskilk

We wouldn't advocate extending the soldermask beyond the component body but yes to ganging for fine pitch. To ensure we don't run into issues with flaking our preference is not to add solder mask when the space between pins is less than 6 mil.

Solder mask and fine pitch devices

Electronics Forum | Tue Jan 08 09:23:18 EST 2013 | lock_2002

This is a question regarding soldermask between pins of fine pitch devices. The majority of our production designs end up with at least 2-3 mils of copper thickness on the external layers due to blind vias, wrap plating requirements, etc. Our curre

Uncoalesced solder problem in fine pitch IC pads

Electronics Forum | Wed Sep 10 15:37:31 EDT 2008 | scottp

At the risk of painting with too broad a brush: QEs are like seagulls: fly in, make lots of noise, crap all over things, then fly away. Back to the knob turning vs. analysis debate. Part of it may be different industries. We're in the high reliab

defects in pcb manufacturing

Electronics Forum | Fri Oct 30 10:36:26 EDT 2009 | richie_puthotta

Hi, I see a huge solder mask shift on chip comp pads. This would result in mid-chip solder balls or solder beads. Overall, the solder mask workmanship is not acceptable. Mask is on pad.

Voiding in uBGA's w/blind uvia's in pads

Electronics Forum | Fri May 02 09:37:23 EDT 2003 | Jerry Magera

Via in pad is the most efficient use of space. Blind via seems to be blamed for this. Cross-sections (send me some) will probably show a void still existing in the via or spherical voids aligned near the component pad side. One can estimate the vo

Via in pad

Electronics Forum | Fri Jun 11 08:38:55 EDT 2004 | davef

We figured you were going to say that. Pay me now, or pay me later, you call it. As an alternative: * Cover the backside of the via with masking tape that will take soldering temperature, like Kapon, or a temporary solder mask * Enlarge the apertur

Solder Balls in Vias

Electronics Forum | Tue Jun 04 15:52:44 EDT 2002 | Hussman69

Closed by solder mask? At any rate, still sounds like wave solder. Take a look before and after wave. That should tell ya.

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