Electronics Forum | Fri May 10 01:41:04 EDT 2002 | ianchan
Steve, Hi mate, was doing some text book reading and saw this one paragraph that commented on the PCB fab plating could have residue chemistry inherent in the PCB if the fab process control isn't up to mark. such chemistry could surface to the Au/N
Electronics Forum | Sat Apr 14 09:28:58 EDT 2007 | davef
When soldering a component to a board, the solderability protection on the component combines with the solderability protection on the board and the solder to form an alloy. This alloy is unique for that combination of solder and solderability protec
Electronics Forum | Tue Apr 13 09:11:54 EDT 1999 | Dave F
| We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to
Electronics Forum | Thu Apr 22 17:19:57 EDT 1999 | JohnW
| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t
Electronics Forum | Fri Apr 16 11:07:53 EDT 1999 | Vic Lau
| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t
Electronics Forum | Thu Apr 22 14:31:39 EDT 1999 | Dave F
Michael: Two things: 1. Profile: A. Your FR4 profile will not produce good solder connections on your ceramic substrate. Hey wait a minute, you soldered FR4 at 250C?? Ceramic is a themal sponge. You'll need to play, but it should be easy compare
Electronics Forum | Tue Nov 21 19:23:15 EST 2006 | greg york
Had exactly the same problem the other week. Baked some boards did improve slightly but not convincingly. Washed bare PCb and found excessive HASL fluids left on board from improper rinsing and problem disapeared. Baking HASL fluid out is impossible
Electronics Forum | Fri Jul 16 14:34:18 EDT 1999 | Glenn Robertson
| We are converting from COB to SMT on a product line and want to optomize the PCB as far as Laminate, plating, passivation etc. This is a high temp application 150C. We are presently using BT Laminate but would like to get away from this. We are
Electronics Forum | Wed Feb 20 15:20:34 EST 2013 | hegemon
Depending on your requirements, you could range from a hair dryer, heat gun, toaster oven, hot plate, on up to digitally controlled surfaces and convective systems. You'll have to gauge for yourself whether you are just trying to add some heat energy
Electronics Forum | Fri Jun 03 15:19:32 EDT 2022 | dwl
I don't recall thicknesses off the top of my head but brittleness becomes an issue more for gold plating then ENIG. .125 um should be fine. also, gold ain't cheap so its unlikely your PCB fab will get anywhere near the max tolerance. On the other e
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