Electronics Forum | Fri Oct 09 00:57:05 EDT 2009 | jjmag921612000
SteveO, I had personal experience with this using a Panasonic MPAV2B. It took a while, but I believe the end result was to have some additional "Z" travel to press the QFN into the paste. Also, the design of the paste on the ground was key to keep t
Electronics Forum | Fri Oct 16 14:45:58 EDT 2009 | cyber_wolf
Many pick and place platforms rely on nozzle spring pressure to determine how hard a part is getting pushed into the paste.
Electronics Forum | Tue Jul 28 16:37:24 EDT 1998 | Terry Burnette
| I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the r
Electronics Forum | Thu Feb 24 00:37:08 EST 2022 | joshsvoboda
I have a pcb with an ENIG finish that is using a 144 pin LQFP and being soldered withSN100C/NC258 T4 paste. I used a oven profiler where the probes are taped down to the joint and the profiling software adjusts the program for the best profile for
Electronics Forum | Thu Feb 24 15:36:34 EST 2022 | dontfeedphils
Looks like a decent profile. Only recommendation I have would be to possibly try and high-temp solder the thermocouples rather than the aluminum tape/kapton, only because you can get air-gaps and inaccurate readings using the tape method on assemble
Electronics Forum | Thu Feb 24 20:39:05 EST 2022 | joshsvoboda
there is evidence of wetting on the heel. This is the first time I have had this type of joint using SC100C on a leaded part. Usually there is at least some wetting on the sides instead of just looking like it is pressed in and sitting on top of the
Electronics Forum | Thu Jul 23 13:11:13 EDT 1998 | Gestapo Allen
I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the rew
Electronics Forum | Wed Jun 03 13:56:09 EDT 2009 | mika
less total area of voids, which mean a much more strength in the joint and much easier to solder such a cooling pad grounded via vias, with this approach! The same goes for big cooling pads of let say Power transistors without any via etc. Always re
Electronics Forum | Sat May 30 01:31:49 EDT 2009 | mika
make 4 square rounded corner apertures on the ground pad and the total reduction of 20 % (80 % solder paste). Then you still be able to solder the terminals around. Don't worry to much of the void's. Just following my tips and you will be fine. The
Electronics Forum | Wed Apr 27 14:10:30 EDT 2005 | Bruno Lalonde
I m looking to implement a maintenance program here at Exfo, I'm looking form the norms on the hand soldering iron (tip to ground resistance and Voltage linking). Thank
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