Electronics Forum | Wed Apr 27 21:59:34 EDT 2005 | davef
Check with your soldering iron supplier. We'd expect them to say: * Tip to Ground Resistance:
Electronics Forum | Mon Aug 23 05:00:20 EDT 2004 | Jefflee
Hi, Would like to know if the design of the Bga pad is depth and after used solder wick and soldering iron to remove the the damage solder ball,there are still remaining solder inside the pad.Is there any method to remove the remaining solder. Thank
Electronics Forum | Tue Aug 24 12:20:33 EDT 2004 | davef
The methods Terry mentioned are good, but our operators are too impatient. Here's how they do site prep, after removing the BGA: * Use a soldering iron to melt the solder at the base of the ball. * Flick the ball[s] from the pad[s] with the solderin
Electronics Forum | Mon Aug 23 16:37:22 EDT 2004 | Terry
Three methods, all work, all require generous use of flux. 1.) Use a heated, electrical desoldering tool with flux. Just be sure that you select a forgiving desoldering tip with a rounded tip end to it so that you do not scratch the pad. Advantage:
Electronics Forum | Mon Aug 23 21:47:49 EDT 2004 | Jefflee
Hi Terry, Thanks for the reply,but if the Bga are in big quantity like 10k and above,is there any faster method to solve this problem
Electronics Forum | Wed Nov 10 02:20:07 EST 1999 | Marc
The padsfor large heat sinks are being designed on our boards with large copper ground planes surrounding them by our engineers. I am having great difficulty keeping the reflow temperature below 230 degrees in order for the temperature of the copper
Electronics Forum | Mon Feb 03 22:48:00 EST 2003 | vinesh
Hi all, We are using small CSPs (10x10mm) in one of our products which has a big ground pad in the center (7x7mm). The maximum voiding allowed on this big pad is also no greater than 25% which we are finding very hard to achieve. The centre pad ha
Electronics Forum | Fri Feb 07 15:17:14 EST 2003 | MA/NY DDave
Hi I am pretty sure it isn't the pad that is causing the problem. To me it seems like those via holes through the pcb either to an internal plane or to the other side. I can imagine creating an interesting stencil to accomodate the vias yet you are
Electronics Forum | Wed Dec 08 19:50:34 EST 2004 | shen_zte
can anyone tell me the benifit of the solder mask onto pad(part) or pad defined by solder mask?and how to excute the SMT process ? thanks.
Electronics Forum | Thu Dec 09 07:46:42 EST 2004 | davef
We did this for BGA pads, but have not thought about other types. So, this may or may not apply for those. Pad defined by:||Advantages||Disadvantages Non-solder mask||No point-of-stress concentration at edge mask and solder ball||Smaller pads have
