Electronics Forum | Mon Aug 23 16:37:22 EDT 2004 | Terry
Three methods, all work, all require generous use of flux. 1.) Use a heated, electrical desoldering tool with flux. Just be sure that you select a forgiving desoldering tip with a rounded tip end to it so that you do not scratch the pad. Advantage:
Electronics Forum | Fri Oct 29 05:23:00 EDT 1999 | Wolfgang Busko
Hi Bart, that�s much to high. If that would happen to me my boss would tear my head off. For improving the yields you must find the cause for the soldering problems. What are the symptoms? What could be the cause for the symptoms? Could be design pr
Electronics Forum | Tue Aug 05 01:13:22 EDT 2008 | Sean
Dear all, As far as I know hot tear or shrink hole defect only happen at plated though hole soldering, especially for those lead free wave process. Recently, a laboratory engineer had done cross section on some of the SMT BGA ball and IC lead solde
Electronics Forum | Tue Aug 02 22:49:55 EDT 2005 | davef
IPC-A-610D Section 5, shows a variety of photographs of: * Good lead-free solder connections * Lead-free soldering anomalies Hot Tear / Shrink Hole is one such anomaly. This shrinkage effect appears primarily on wave-soldered joints, but can also
Electronics Forum | Tue Sep 20 17:09:14 EDT 2005 | hly
I have a situation with hot boards with fine pitch BGAs that I need to build. However, there is a big problem--the auto screen printer is down. I decided that we would use the stencil and manually line up the pads and do a manual print. I can't ac
Electronics Forum | Mon Aug 01 20:02:20 EDT 2005 | Joseph
We use SAC305 and top side particular joint temp. is 110 deg C, and the terminal finish for that particular lead is pure tin. It look like hot tearing at the primary side of PTH.
Electronics Forum | Fri Jun 09 07:26:24 EDT 2006 | amol_kane
hi, gald to hear that yr process is working well.....we are in the process of buying a wave with SN100C solder.....any pitfalls/precautions that you took during the transition? did you do any DOE for setting up the profile values?? are you seeing a
Electronics Forum | Fri Jan 15 09:27:18 EST 1999 | Earl Moon
| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat
Electronics Forum | Sat Jan 16 03:06:36 EST 1999 | Wirat S.
| | Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | | | Regard
Electronics Forum | Fri Jun 09 11:55:34 EDT 2006 | jbrower
Howdy Amol, As far as I can see, there aren't too many pitfalls with SN100C. Just make sure to keep all of your alloys seperated. The issues that I am working out right now is the profiles with our wave pallets and some of our larger components. We
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