Electronics Forum | Fri Jul 27 15:51:29 EDT 2007 | hussman
Well I agree with jdumont in the fact that you should reduce the center pad at least 50%. Generally the sides of the leaded ends are not plated and solder will not wick up. This means only the bottoms of the leads wil solder. Look in this area whe
Electronics Forum | Tue Jul 24 07:57:55 EDT 2007 | davef
It sounds like the QFN component is not solderable. * Use ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires * Contact your QFN component supplier for help * Consider a more active flux, since you might
Electronics Forum | Fri Jul 27 12:13:57 EDT 2007 | jdumont
We have issues with these also. They need to be flat to solder well. Reduce the square under the part for the heat sink and youll improve yields. That pad keeps the part lifted high while the other smaller joints reflow and partially attach. You can
Electronics Forum | Thu Jul 26 23:43:49 EDT 2007 | gioblast
check your stencil design on the ground pad. You might have a big aperture opening that pushing the component away from the paste. Look alos the way your pcb warp. Prioritize side that has component that need flat pcb as much as possible. hope this h
Electronics Forum | Fri Jul 27 08:49:35 EDT 2007 | cman
We are currently have failures on one of our QFN > components. We are running this product with > lead free paste, lead free boards and lead free > parts. They have done a pull test on this > component and it showed that the solder joint > mai
Electronics Forum | Tue Jul 24 07:15:16 EDT 2007 | james
We are currently have failures on one of our QFN components. We are running this product with lead free paste, lead free boards and lead free parts. They have done a pull test on this component and it showed that the solder joint mainly dissconnect
Electronics Forum | Tue Aug 09 12:31:11 EDT 2005 | Rob
Are they being shadowed by larger components?
Electronics Forum | Tue Aug 09 13:25:18 EDT 2005 | russ
Try cooling them down in the profile.
Electronics Forum | Tue Aug 09 12:09:26 EDT 2005 | mtd
I am having reflow issues with small 6 pin SOT's. The joints on these components still look like solder paste after the reflow oven. I have tried adjusting the profile on forced air oven. Any recommendations as what to change in the profile or proces
Electronics Forum | Tue Aug 09 13:44:48 EDT 2005 | mtd
The solder on the rest of the board looks good. There are no large components around these parts. We check the profile using a KIC and it met the recommendations of the solder paste manufacturer. I have not did a dip test of the board or components.
