Electronics Forum | Thu Aug 24 17:08:58 EDT 2000 | Dr. Ning-Cheng Lee
Depending on the stress condition experienced by the solder joints. For joints under a greater stress, the time to reach equilibrium can be shorter. Of course, the change is also more significant in phase structure. For low stress conditions, it may
Electronics Forum | Tue Dec 01 12:44:15 EST 1998 | Earl Moon
| | | | | All y'll: I could use your input on determining when to skim dross from a wave solder pot. | | | | | | | | | | On one hand, dross protects the surface of the solder from oxidation. On the other hand too much dross may affect solder joint
Electronics Forum | Tue Dec 01 13:53:12 EST 1998 | Brian Conner
| | | | | | All y'll: I could use your input on determining when to skim dross from a wave solder pot. | | | | | | | | | | | | On one hand, dross protects the surface of the solder from oxidation. On the other hand too much dross may affect solder
Electronics Forum | Wed Dec 02 09:03:34 EST 1998 | Dave F
| | | | | | | All y'll: I could use your input on determining when to skim dross from a wave solder pot. | | | | | | | | | | | | | | On one hand, dross protects the surface of the solder from oxidation. On the other hand too much dross may affect
Electronics Forum | Wed May 24 15:59:34 EDT 2006 | JohnM
I have a product with mixed in Pb free and Pb BGAs. I decide to use SnPb paste with Pb free reflow profile to make it work for both types of BGA. Do I have a reliability solder joint issue by using this method? How is your opinion on this case? Can
Electronics Forum | Wed Oct 30 02:37:58 EST 2002 | Dreamsniper
Hi Guys, I have a fine pitch QFP that I suspect of having a solderability (wetability) problem. The heel joint is 50%-75% of the lead thickness so it means that I passed the IPC Class 2 recommended criteria on the Heel. The toe has at least 25%-50% s
Electronics Forum | Wed Sep 05 10:59:02 EDT 2007 | slthomas
What's sad is, it really happened. I won't bore you with the details again. ;) Lloyd, I would love to have a nice Hi Scope too (I think Cchunks works for one of those big champagne and caviar corporate entities ;)) but if you can't swing it, at leas
Electronics Forum | Mon Jun 05 10:32:39 EDT 2000 | Khalid Saeed
It could be a gold finish problem. The recommened gold finish thickness is less than five micro inches. Gold thickness greater than five microi inches is significant contributor for causing embrittlement of the solder joints. Verify the reflow profil
Electronics Forum | Mon Oct 05 14:51:22 EDT 1998 | Bob Lepianka
Does anyone know of an AOI system that can look at the solder joints of SMT chip devices (1206,0805 & 0603) and make a reliable presence/abscence call of the joint on a HASL PCB. A low false call rate (much less than 1%)is required. Any info. from
Electronics Forum | Wed Mar 06 12:24:36 EST 2002 | JasonGregory
The term is indeed "slice", Daniel. I am the 5DX engineer here in Austin, TX. To answer your question, The 5DX can slice at varying heights of virtually any solder joint. By changing certain comment lines of the NDF and RTF files, the 5DX can view th
