Electronics Forum | Wed Jan 15 19:27:43 EST 2003 | praveen
Grainy finish of the solder joint also caused by higher reflow temp.So far we have observed grainy structure in case of gold plated board.
Electronics Forum | Wed Jan 15 19:27:44 EST 2003 | praveen
Grainy finish of the solder joint also caused by higher reflow temp.So far we have observed grainy structure in case of gold plated board.
Electronics Forum | Thu Jan 16 10:18:53 EST 2003 | burb1999
I have heard that the profiles are pretty much the same but I have a visible solder joint difference... might half to start looking at the plating, might be something with that?
Electronics Forum | Tue Jun 14 17:01:18 EDT 2005 | peter ng
It's impossible to do so.The cooling phase is important to perform the strength of the solder joint.Without this phase,the good solderbility will not able to achieved.
Electronics Forum | Tue Feb 07 19:10:04 EST 2006 | GS
Hi, other effect could be the extra inter-metallic thickness that could compromise the solder joint reliability. just my 0.00001 Doblon Best regards.........GS
Electronics Forum | Thu Sep 03 02:38:00 EDT 2009 | sachu_70
Does the established joint still exist if once again re-touched by a soldering iron, or does it return to the original problem? Wetting issues on pad could be for many reasons and you could analyze with a cause effect diagram.
Electronics Forum | Wed Apr 06 10:18:02 EDT 2011 | PB
I have done the same thing. We are changing over to the Indium 8.9E solder paste. It prints great and the joints look great. Does not look like a lead free alloy. We have turned off the nitrogen.
Electronics Forum | Sat Oct 01 01:25:30 EDT 2005 | ck
Sorry theres a mistake on previous question. It should be lead free component termination but non lead free solder alloy Sn63/Pb37. The reflow profile i am using : Soaking temp. 120 to 160 deg C; time 90 to 120 sec. Peak temp. 215 to 225 deg C; time
Electronics Forum | Fri Feb 13 03:53:40 EST 1998 | Brian S. Bentzen
Hi , I have not been able to find any good description on how to perform double sided reflow on PCBs.The best would of course be to avoid reflowing the bottom side again but in real life this is not possible. So when double sided reflow soldering
Electronics Forum | Fri Apr 23 13:31:20 EDT 2004 | russ
The toes of leaded devices are problematic in fillet formation. A lot of the time they have the copper from the lead exposed so it becomes oxidized and won't readily take solder. Normally this is of no concern if the heel and side fillets are forme
