Electronics Forum | Wed Mar 26 09:19:20 EDT 2008 | nibirta
hi all...well i`m working in such a lab but we are working internally, and for our customers. But i can give you some prices from other labs. Cross section-one location is around: Solder Joint Integrity Std. sample plastic package $300.00 Shorts /
Electronics Forum | Thu May 26 07:50:33 EDT 2011 | scottp
What process steps have been completed before the cross-section? What type of devices have solder cracks? Are the cracks found after just normal processing or after some type of validation testing? It is very unlikely to be a heating/cooling issue
Electronics Forum | Wed May 25 21:03:30 EDT 2011 | thanhnguyen22
Hi All, I am new the PCBA process fabrication. I have found many cracks in the PCB after we have cross sections analysis. The cracking has same kind of pattern. It happens betwen the solder and the PCB, or between the solder and the part, BUT not be
Electronics Forum | Thu May 26 08:09:52 EDT 2011 | davef
Maybe attaching some pictures of your cracked solder connections might help us in offering suggestions to help you with your problem
Electronics Forum | Mon May 26 08:02:11 EDT 2003 | davef
Resistance: Tables of wire gauge often provide a resistance measure of some kind for each gauge. That way we can estimate the resistance of any length of wire we might be interested in. Calculating trace resistance is only slightly more complicated.
Electronics Forum | Tue Nov 05 09:57:45 EST 2013 | cuperpeter
Hello All, We have a problem with dewetting of solder paste. Problem is most visible on the pads without components (see attached pictures) and occurs randomly, 20% of PCB's. Pcb supplier sent us a cross-section of pads with thickness of Cu, Ni and
Electronics Forum | Sat Jun 28 08:17:21 EDT 2003 | davef
We form a barrier to contain the dye, but regardless it is messy. Actually, we no longer use dye, per say. We use the stuff machinists use for staining metal. Look here for hints: * http://www.ivf.se/Elektronik/dye_penetrant/edefault.htm * http:
Electronics Forum | Fri Aug 06 08:38:25 EDT 2004 | Bob R.
You don't mention the board surface finish, but BGA's on NiAu are prone to brittle fracture in the Sn-Ni intermetallic on the board side of the joint. You may not be able to see it visually, but it would show up in a cross-section. In-circuit test
Electronics Forum | Mon Jun 11 21:56:41 EDT 2001 | davef
Continuing, I�ve optioned about the uselessness of shear testing of solder connections on this forum previously. So, the points that you make about the elusiveness of developing a standard for measuring solder connection strength is well taken. I�l
Electronics Forum | Tue Aug 05 01:13:22 EDT 2008 | Sean
Dear all, As far as I know hot tear or shrink hole defect only happen at plated though hole soldering, especially for those lead free wave process. Recently, a laboratory engineer had done cross section on some of the SMT BGA ball and IC lead solde
