Electronics Forum | Mon Jun 18 11:23:44 EDT 2001 | Gil Zweig
BGA defects observed with x-ray inspection fall into catagories. One catagory is the obvious defects; i.e. soledr bridges, missing balls, excessive solder voids. The second catagory is the more subtle "potential" defect. This is where variations in
Electronics Forum | Tue Dec 15 02:00:32 EST 2015 | padawanlinuxero
We do what here is call a master, this board has a bunch of misalign components, missing components, bad solder joints, crack components, and other defects that we want the AOI to look for, now we compare what the AOI finds with a list of the defects
Electronics Forum | Fri Dec 02 08:52:05 EST 2005 | pavel_murtishev
Good evening, I�ve just solved very similar soldering issue. In my case the problem was with 0603 chips. Solder joint had same appearance. I suspected that solder do not melted and increased TAL and peak temperature. No result. Next thing I tried to
Electronics Forum | Mon Nov 15 02:45:15 EST 2010 | 89jeong
Hello. We encountered a SMD problem on PCB. It is that the lead of photocoupler is shifted after reflow and don't meet the minimum requirement of side joint length. I know this is a defect but what i want to hear the reason and the solution to prev
Electronics Forum | Fri Oct 06 16:07:50 EDT 2000 | Carol Zhang
Rick, Do you check both side of the board after wave? Can you check the orientation of components, missing of components and also the solder joint defects? We are also very interested in this type of machine. Thanks for the information. Carol
Electronics Forum | Tue Nov 05 22:19:07 EST 2002 | Victor Salazar
I am seeing quite a bit of grainy solder joints. I am told this can be from being in a liquidus state for too long. Does anybody have any information on this defect?
Electronics Forum | Tue Oct 21 09:28:11 EDT 2003 | bwet
In terms of an outgoing QC measurement does anyone have some guidance? If ppm defect rates are established is it per board or per solder joint? We are a contract manufacturter trying to establish such a measurements without having to cover old ground
Electronics Forum | Wed Nov 03 09:59:47 EST 2004 | Simon UK
Hi Dennis, I would say that you must meet one of the acceptable critera if you have others list, but it depends. Do you have a specific query in relation to a solder joint or other defect?? Simon UK
Electronics Forum | Thu Apr 19 02:49:07 EDT 2007 | ray
I observed some black dot or some oxidation occured on chip termination on pcba reflowed fews weeks ago as buffer stock. The solder joint and fillet wetting is good and shinning. It is an acceptable or defect condition per IPC standard/requirement? W
Electronics Forum | Wed Dec 04 07:39:11 EST 2019 | proceng1
I still don't see the defect, but in general, yes you can use an iron to reflow and cracked or suspect joint. You may want to add a little flux before you apply the iron.
