Electronics Forum | Mon Jul 19 08:55:54 EDT 2004 | dwanzek
Thanks, good input. The joints do seem to wet well, they pass solderability test we have done. The defect is apparent right after reflow, before wave solder. No we do not profiled with the oven loaded..... good idea. We run an ovenrider each shift an
Electronics Forum | Thu Jun 23 23:58:03 EDT 2011 | jamessunderland
Just want to ask. What is the effect of dull gold surface on solderability? When I made a test run with several pieces containing dull gold defect on the pad(of varying levels), I found that components can still stick to the pad with good amount o
Electronics Forum | Thu Jul 02 16:01:57 EDT 2009 | ewchong
thanks kpm. agree the cause of those pads lifting. all of them were no connects so they cannot be the cause of the electrical failure. when the bga was removed, all the solder balls on the pcb turned into conical shape due to the separation, except
Electronics Forum | Wed Oct 07 06:19:30 EDT 1998 | Charles Stringer
| | | Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | | | DPM is Defects per million, usually measured on components. We run a process consisting of small to medi
Electronics Forum | Mon Jul 23 12:12:57 EDT 2001 | kennyhktan
Good day! As we all know the normal recommended solder paste(Sn62/Pb37) reflow profile time is around 40~60sec above the temperature of melting point. Now I'm setting my peak temperature at the high site of solder paste recommended spec. due to metal
Electronics Forum | Thu Dec 09 04:53:36 EST 1999 | Glen brain
Hi, It is wavesoldering defect, in single- sided copper board, using alcohol-based rosin flux. It is not a bridging between the protruding leads but a metallic (I think, it is solder) link, varies in dia./thickness, connected the basement of solde
Electronics Forum | Thu Apr 14 05:20:58 EDT 2005 | aj
All, I am considering trying out the above to try and eliminate some of my defects on the wave process aswell as reducing cycle time etc. Incase of unfamiliarity with what it is : basically there is a Solder Preform present on the Header/Connector a
Electronics Forum | Wed Dec 07 00:43:13 EST 2005 | ajay
Hello All, Do any acceptable criteria is followed on DPM for SMD soldering joint / defect. We do face tough time with QA, as they demand 100%. Our SMD board is having about 2000 soldering point & even 99.90% ok (1998 points ok out of 2000) QA do not
Electronics Forum | Thu Apr 14 15:27:05 EDT 2022 | ppcbs
If it was ROHS I would suspect copper migration. In my experience an acceptable copper finish should last up to at least 6 reflow cycles. If you have bubbles or blow holes in the solder joint, that is a sign of voids in the walls of the copper barre
Electronics Forum | Thu Aug 04 19:00:25 EDT 2022 | SMTA-64386637
I am investigating the use of conductive epoxies to connect battery leads, Charging pins and wires inside small plastic housings. Soldering in these small spaces can create heat related defects in the plastics even when using low temp solders. Are
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