Electronics Forum | Tue Feb 08 04:27:55 EST 2011 | thomas111
hi, I am a Hardware designer . One of my products is undergoing a Reliability test in which a resistor shows a high value on board from its specified value .However it retains the original value when its cooled under room temperature. The resistor
Electronics Forum | Wed Sep 30 11:32:45 EDT 2009 | pbarton
What type of conformal coating are you using and are you allowing the coating to migrate under the device in question? If you are allowing the coating unbder the BGA the problem could be CTE of coating is much greater than that of the BGA balls/sold
Electronics Forum | Thu Oct 08 08:15:39 EDT 2009 | kpm135
We've used both 1A33 urethane and 1B31 acrylic coating on our SMT assemblies with great success for many many years. This is with components of all shapes and sizes including a 9 ball micro-BGA. We apply the coating in every way imaginable and we hav
Electronics Forum | Tue Feb 03 12:24:56 EST 2004 | swagner
Paul, do you have any kind of false failure data for the application you struggled with? Also what amount of manpower did you use to operate the system(s).
Electronics Forum | Wed Jan 30 17:47:22 EST 2002 | davef
Oooo, pix, coo!!! Yes, that solder connection has been beat-up. It is very �old�. So, your customer is seeing failures, correct? I can believe it. I want to say the solder in your connections doesn�t stand a chance, but lack experience in this a
Electronics Forum | Tue Jun 25 09:45:39 EDT 2019 | edhare
See also ... https://www.semlab.com/solder-joint-failure-modes/
Electronics Forum | Tue Dec 14 10:58:56 EST 2004 | Peppe
Thanks for your answer Dave. Just a clarification. Given FIT is for just one soldering or for a specific number ? I mean cards we produce have, typically, 10000 soldering joints. Which is the expected FIT of that card ? Thanks again for your help.
Electronics Forum | Mon Dec 13 06:21:14 EST 2004 | Peppe
I work in electronic industry and I'm interested about the standard values of FIT (failure in time or useful lifetime) of soldering. In essenze my question is : how much time can work a good solder joint, before became fail ? Exist a minimum and ma
Electronics Forum | Fri May 31 05:54:09 EDT 2019 | dhanish
What are the common cause for solder joint crack after the pcba go through Temperature cycling test ?We have seen failure on solder joint for the memory part.
Electronics Forum | Wed Jan 07 00:18:14 EST 2009 | milanrit
Recently on one of my assemblies(sn/pb) I started seeing leaded BGA failure at functinal test for opens, but when I inspected them through 5DX and ERSA Scope it doesnt seem like there is any opens or insufficient and half no. of boards passed functio
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