Electronics Forum: solder joint failure potting (Page 1 of 39)

solder joint failure analysis

Electronics Forum | Tue Feb 08 04:27:55 EST 2011 | thomas111

hi, I am a Hardware designer . One of my products is undergoing a Reliability test in which a resistor shows a high value on board from its specified value .However it retains the original value when its cooled under room temperature. The resistor

Need a UV resistant black potting material

Electronics Forum | Thu May 27 22:29:14 EDT 1999 | Mike Flori

Does anyone have a suggestion for a UV resistant black potting material? The material recommended by a local vendor turned gray in a couple of months in the sun here in Florida. We are using L.E.D.'s in a small housing (about 1.2" cube) and need to s

Re: Need a UV resistant black potting material

Electronics Forum | Fri May 28 11:14:21 EDT 1999 | TONY MASTROIANNI

| Does anyone have a suggestion for a UV resistant black potting material? The material recommended by a local vendor turned gray in a couple of months in the sun here in Florida. We are using L.E.D.'s in a small housing (about 1.2" cube) and need to

Re: Need a UV resistant black potting material

Electronics Forum | Fri May 28 11:22:21 EDT 1999 | TONY MASTROIANNI

| Does anyone have a suggestion for a UV resistant black potting material? The material recommended by a local vendor turned gray in a couple of months in the sun here in Florida. We are using L.E.D.'s in a small housing (about 1.2" cube) and need to

Re: Need a UV resistant black potting material

Electronics Forum | Fri May 28 12:51:11 EDT 1999 | John Thorup

| Does anyone have a suggestion for a UV resistant black potting material? The material recommended by a local vendor turned gray in a couple of months in the sun here in Florida. We are using L.E.D.'s in a small housing (about 1.2" cube) and need to

bulbous joint

Electronics Forum | Fri Feb 20 08:44:05 EST 2004 | davef

Lucky guess, eh? [Sorry to blow your theory on bad parts] A 1000 of these boards on the line, ummm. Two ideas to consider: * Increase the conveyor angle [don't get carried away, just keep the angle below 8*]. * Balance the flow of solder so that th

MELF component/solder failure

Electronics Forum | Tue May 06 15:53:52 EDT 2003 | bremerg

The coating is pliable and is air cured for 24 hours. The potting compound goes into the top assemnbly in 3 diferent stages. The circuit boards are coated using urethane type conformal coating. The unit is also placed into an ESS chamber -40� to +

MELF component/solder failure

Electronics Forum | Thu May 08 10:16:17 EDT 2003 | davef

Observations are: * Center most lead of the fuse on the top right of the assembly looks like it has excellent solder flow, but this is PTH. From the amount of solder, it must have been wave or hand soldered. * Center most lead of the fuse on the bot

BGA failure after coating

Electronics Forum | Wed Sep 30 11:32:45 EDT 2009 | pbarton

What type of conformal coating are you using and are you allowing the coating to migrate under the device in question? If you are allowing the coating unbder the BGA the problem could be CTE of coating is much greater than that of the BGA balls/sold

BGA failure after coating

Electronics Forum | Thu Oct 08 08:15:39 EDT 2009 | kpm135

We've used both 1A33 urethane and 1B31 acrylic coating on our SMT assemblies with great success for many many years. This is with components of all shapes and sizes including a 9 ball micro-BGA. We apply the coating in every way imaginable and we hav

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