Electronics Forum | Tue Dec 23 01:23:45 EST 1997 | J.H Kim
I'd like someone gives me a tip for elemating of voids in the mico BGA solder joint and the method of inspection of them, very exactly.
Electronics Forum | Wed Apr 30 09:13:30 EDT 2003 | pjc
Yes, there is a limitation with Transmission X-ray on double-side SMT boards, ie.: back-to-back solder joints, components on bttom side over a solder joint.
Electronics Forum | Mon Apr 14 10:50:43 EDT 2003 | emeto
Pete I'm not very informed about it but from the things I red today - 2D inspection : solder component solder joints x-ray and what ever type exsist.
Electronics Forum | Wed Apr 30 08:00:33 EDT 2003 | pjc
Jason, In Transmission AXI the entire solder joint volume is imaged, not just a slice (no missing information) as with Cross-Section. Also, there is no signal loss from mechanical or digital image reconstruction (highest contrast and edge strength).
Electronics Forum | Sun Dec 28 05:31:59 EST 1997 | Bob Willis
We have a x ray inspection criteria video and poster set which may be of interest check out our home page www.bobwillis.co.uk | | I'd like someone gives me a tip for elemating of voids | | in the mico BGA solder joint and the method of inspection |
Electronics Forum | Wed Nov 14 10:23:51 EST 2001 | gzweig
This question and other issues on x-ray inspection of BGAs are addressed in the free PDF. publication available by e-mail entitled: Rapid and Effective X-ray Inspection of BGAs using "Signature Identification" Just place "send publication" in subj
Electronics Forum | Mon Nov 12 11:40:50 EST 2001 | caldon
Your broad question will bring many answers.You do not mention PCB type which plays a key part in the inspection specs you look for. Your question is like asking "What is the best automobile?" You will have 1,000,000 answers. Best answered this way:
Electronics Forum | Mon Nov 12 06:05:15 EST 2001 | nop_e
Dear all I 'm looking the minimum X-Ray machine capability that is capable to inspect the solder joint of BGAs, Fine pitch BGA and CSP such as open, poor solder joint ,etc... What is the machine specification needed? Thank you for your advise.
Electronics Forum | Tue Dec 23 01:25:38 EST 1997 | J.H Kim
| I'd like someone gives me a tip for elemating of voids | in the mico BGA solder joint and the method of inspection | of them, very exactly.
Electronics Forum | Thu Feb 19 12:56:29 EST 1998 | Earl Moon
| I'd like someone gives me a tip for elemating of voids | in the mico BGA solder joint and the method of inspection | of them, very exactly. Voids in excess of 20% by each solder ball volume is cause for rejection. Causes are improperly managed proc
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