Electronics Forum | Mon Apr 21 11:55:29 EDT 2008 | realchunks
"Disturbed" usually means some form of movement. I would think your leads are moving due to warp as the board exits the reflow zone. Not knowing your profile, I would suggest checking your profile. Make sure you have adequate "above liquidous" and
Electronics Forum | Sun May 23 07:13:56 EDT 1999 | Scott Cook
| Has anyone had any experience or data using vibration during the reflow process. | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process worked v
Electronics Forum | Thu Apr 22 08:43:25 EDT 1999 | Michael N.
| | I'm having problems with trying to get a good solder joint using a Ceramic PCB. We are using AMTECH hi-temp solder (ws-486 96.5/3.5ag). My profile looks great and I used the recommended profile from Amtech with a few adjustments. My max temp is a
Electronics Forum | Mon May 24 09:52:06 EDT 1999 | john thorup
| | | Has anyone had any experience or data using vibration during the reflow process. | | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process
Electronics Forum | Mon Nov 11 11:42:26 EST 2002 | MikeF
Like Mark, I'm guessing your problem is with SMT parts on the top side, the solder is re-melting and some of the parts are moving around during when the board is being wave soldered. When I had some training on thru hole wave soldering way back when
Electronics Forum | Mon Mar 22 09:37:28 EST 2004 | ellis
After 2nd time reflow of double reflow, wrinkles solder joints found on SOIC and SOT components.(only happen on the components at the underside of pcb during reflow, top side components dont have this problem) is this due to the reflow process proble
Electronics Forum | Wed Mar 24 08:36:58 EST 2004 | Evtimov
Hi! What exatly you do? Do you reflow the both sides of the board at the same time or you reflow your second side? I think in both cases you should decrease you bottom zones. If you reflow both sides - with 10-20C(F) If you reflow the second side - w
Electronics Forum | Mon Sep 20 13:04:25 EDT 2004 | davef
The Intel BGA Developer�s Guide [ http://developer.intel.com/design/packtech/ch_14.pdf ] says: 14.8.3.3 Plated Through Hole (PTH) Isolation Regardless of the technique used for the mounting pads shape or definition, isolation of the plated through h
Electronics Forum | Tue Aug 09 12:09:26 EDT 2005 | mtd
I am having reflow issues with small 6 pin SOT's. The joints on these components still look like solder paste after the reflow oven. I have tried adjusting the profile on forced air oven. Any recommendations as what to change in the profile or proces
Electronics Forum | Mon Mar 22 10:24:03 EST 2004 | davef
Wrinkled like orange peel?
