Electronics Forum | Tue Jan 15 06:05:37 EST 2002 | Romain
Dear all We have since few weeks problems with BGA solder joint integrity on ENIG finish. Under relatively very flexible of the FR4, the joint breaks between ball and PWB. When we take off the BGA for analysis, some of the pads seem very flat, totaly
Electronics Forum | Thu Oct 25 04:52:17 EDT 2001 | Vai
I'm running intrusive reflow. What happened was when the board went thru' the first reflow ( which is secondary side ), at Post reflow, I can see the solder joint quality is very good smooth and shiny. But when we proceed with the 2nd reflow, at Post
Electronics Forum | Mon Feb 02 12:36:41 EST 2004 | paul_bmc
90% of the assemblies our company produces are class 3 and we have no problem at all inspecting or getting class 3 quality through reflow. Rarely do we have touch up because of insufficient or poorly reflowed solder joints. What are the problems you
Electronics Forum | Wed Jul 03 03:02:35 EDT 2013 | autoel
How to test the reflow solder joint shear strength? What are the specification to test solder joint shear strength? What are the different methods to test the solder joint shear strength? Vijayashree
Electronics Forum | Wed Jan 28 14:35:12 EST 2004 | swagner
Has anyone in the industry had even a fair amount of success inspecting reflowed solder joints to IPC class 3 standards? I am not interested in hearing from system reps or people who work for an AOI manufacturer. Thanks,
Electronics Forum | Mon Feb 02 17:52:11 EST 2004 | swagner
We are not having a problem, we have a customer that would like us to use post reflow AOI to inspect the solder joints to class three. I would like to see if anyone is having sucess doing this.
Electronics Forum | Tue Feb 03 12:24:56 EST 2004 | swagner
Paul, do you have any kind of false failure data for the application you struggled with? Also what amount of manpower did you use to operate the system(s).
Electronics Forum | Wed Jan 30 08:30:33 EST 2002 | seto
Hello Dave, Mechanically the conection between the component pad and PCB pad is good (the solder joint is very strong). The problem is associated with poor contact after the use by the customer (vibration, temperature, etc). You can see the pictures
Electronics Forum | Tue Sep 10 07:24:13 EDT 2002 | John
I need teoretical info for theme "Matted surface vs solder ball". Is it right that some solder pastes decrease solder balling but give matted surface after reflow? That diference between these pastes and others? Are the matted surface worse solder b
Electronics Forum | Tue Feb 03 06:52:45 EST 2004 | paul_bmc
About 2 years ago our company tried to go with a post reflow AOI inspection. This AOI was suppose to be able to inspect to a level class 3 product. **It is impossible** You cannot inspect for a heel fillet and inspecting for poor wetting is a very
