Electronics Forum | Tue Feb 03 12:39:20 EST 2004 | paul_bmc
We had the data at the time and it was quite high. More false calls then anything. I do not have the data anymore it since has been archived. When the system was introduced we had 1 engineer and 2 operators trained for programming and running the
Electronics Forum | Wed Jul 03 15:40:17 EDT 2013 | davef
Shear tests are [in my opinion] senseless. The shear stress you measure depends more on the shear rate and on the point where the force is applied than on the grain structure. When shearing a component, you not only apply shear stress, but also roll
Electronics Forum | Mon Feb 02 22:01:24 EST 2004 | Dean
I find this disturbing when customers dictate your process and equipment? Your responsibility is to deliver a quality product on time. Why would your customer care HOW you achieve this? Hence the success of Chinese manufacturing. I have one custo
Electronics Forum | Mon Apr 17 19:30:27 EDT 2000 | Boca
All of the above is good stuff. To add, I have seen this several times if the assembly is wavesoldered. Heat from the wave can partially reflow the top side SM solder joints and weaken them. To test, check joint strength before wave and then after
Electronics Forum | Fri Jun 02 16:30:42 EDT 2000 | Michael Parker
I found a reference to Cost of Conversion earlier this year. Basically, the average cost to convert a single component from raw materials to assembled goods is $.08, just after pick and place. After placement and before reflow, repair (solder paste r
Electronics Forum | Fri Aug 10 13:09:49 EDT 2001 | Hussman
Hey Wister, Assuming you are talking about BGA voids, and you just want to try and optimize your profile, you could try a "straight ramp profie". This is where the soak temp is constantly being elivated until you hit reflow. I find this helped me
Electronics Forum | Mon Oct 18 11:01:26 EDT 2004 | DenisM
I have had similar problems and my customers have had this too. A two story drop test was made by one of my customers and they found that changing Sn63 solder to Sn62 solder made a significant impact. There is no real downside other than a slightly
Electronics Forum | Thu Mar 24 19:17:43 EST 2005 | EA
Hi, We are running the automotive product and question was throw to us how do we ensure that our solder joint are good enough after reflow.....and during the sealant process, there's a bit of bend on the nozzle and it toughes the component and custo
Electronics Forum | Thu May 18 14:30:33 EDT 2006 | Chunks
Hi Mark, I feel like a broken record since I keep replying to this thread. BUT, I remembered a large lytic cap that we had a couple years ago, doing the same thing. The base of the cap would expand in reflow and the bottom would bulge out and only
Electronics Forum | Thu May 18 20:42:36 EDT 2006 | davef
Hypothesis #1: We agree with Steve. You are probably seeing the nickel underplate. The gold was absorbed into the solder in portions of a second, so that you don't see it is not surprising. We're guessing that the gold was porous and allowed the n
